IC Industry Will Embrace 3D ICs in 2015 or 2016

Date:2012/9/4Author:Lynn

The industry's gradual migration toward  3D ICs with through-silicon vias (TSV) is unlikely to happen until 2015 or 2016, according to sources at semiconductor companies. Volume production of 3D ICs was previously estimated to take place in 2014, the sources indicated.

Leading foundries and backend assembly and test service companies have all devoted much of their R&D efforts to TSV development, and are making progress, the sources said. The major players are believed to be capable of supporting 3D ICs by 2014, but the emerging technology going into commercial production may not take place until around the 2015-16 timeframe, the sources indicated.

For customers, particularly IC design houses, there are difficulties adopting the new technology in their solutions due mainly to their insufficient knowledge about chip designs and future trends, the sources said.

Taking system-in-package (SiP) as an example, EDA tools for the technology have become commercially available in recent years. However, system-level packaging had been discussed for many years.

In other news, industry sources recently speculated that Taiwan Semiconductor Manufacturing Company (TSMC) is now capable of fabricating 3D TSV chips, and has been approached by Qualcomm to jointly develop related products.

Tags:IC Industry, 3D ICs , 2015 or 2016
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