Services Items
Visual inspection
The electronic components will be inspected thoroughly by 3D microscope. This item will focus on the external packing; the complete model No, date and batch of label; the chip marking and surface condition of encapsulation; pin arrangement,coplanarity and electroplating state; the actual chip size and the size showed in the specification, etc.
Pin Assignment test
Compared with the X-ray imaging of the samples, whether the chip pin definition is in accord with the specification will be confirmed.
De-capsulation test
Take out the wafer through anatomy technique and analyst the identifying, pinless, domain, MASK and so on. Hence whether the chip belongs to original production or not will be identified.
RoHS test
The European Union has adopted the Restriction of Hazardous Substances (RoHS) in electrical and electronic equipment. This legislation bans the use of lead, mercury, cadmium, hexavalent chromium, Poly Brominated Biphenyls (PBB) or PolyBrominated Diphenyl Ethers (PBDE) in electrical and electronic devices after July 1, 2006.For this, we utilize new model testing instruments to verify if the sample is coincident with the Directive or not.
X-ray inspection
Utilize the X-ray to inspect and analyst the internal of the chip. With X-ray, we can verify that the internal structure is identical or mixed material. The mixed material means in the same batch products, there are different wafers, substrates, lead frames and routings. In addition, it is clearly to see the chip’s routings and open short phenomenon which will directly lead the products to be useless.
Acetone test
Wipe the sample according to the custom chemical of America military. This is to verify if the chip surface is remarked or not.
Pb_free test
Pb is harm to both human being and environment and the European Union has clearly specified that the lead contents should be less than 1000ppm in electronic components. We will detect the sample through SEM/EDX to verify it.
Function test
By utilizing the VLSI/SOC testing system which various testing functions are suitable for display IC, LED IC, power IC, digital consumer IC, CSTN, OLED, MCU and related IC devices and so on, the Lab provides the most cost-effective production test and thorough testing solutions; the Lab offers complete Socket to meet the demand of various kinds of capsulation. Additionally, the specialized transistor testing instrument, LCR and so on instruments enable the Lab to detect passive components, diodes and triodes, etc.