Last year, the Intel leadership announced six technology pillars that support all products: process and packaging, architecture, memory and storage, interconnects, security, and software. Last week, Intel introduced an amazing portfolio of data innovations, including new processors, memory, network controllers, SSDs, FPGAs and more. These two initiatives revolve around the vision of data in this new era – faster data transfer, more data storage, and all data.
This week, I shared the latest news on "Transfer Data Faster" with Intel’s technical leadership team and detailed the features of interconnect technology in Intel’s entire layout. important role.
In the field of interconnect technology, Intel is an industry investment deployment One of the broadest companies. Intel's interconnect technology enables communication between on-chip, in-package, and processor nodes. Data is transmitted between data centers, edge devices, and chips over wired networks or wireless networks. Intel is a leader in all of these interconnects that span micrometers to miles of transmission distance.
Data is growing at an exponential rate, and interconnect technology provides the ability to connect and transmit data. It is estimated that only 2% of the world's data is analyzed, which means there are huge potential development opportunities for future business development and data insight. Interconnect technology is the link between raw data and the value of data extracted by the calculation engine.
Interconnect is the key to improving performance
The rapid growth of data drives scale calculations, The endless demand for storage and interconnection. In short,We can create the fastest processors, the smartest FPGAs or the highest capacity SSDs, but without high-performance interconnect technology to support fast and efficient data transfer, the performance of the entire system or service will never reach its full potential. .
How data moves across the entire micron to mile transmission range will be for each interconnect element, as well as compute, memory, and I/O components across each interconnect The future architecture direction provides a reference and considers how to maintain efficient data flow from chip to edge devices.
Intel’s leadership in multiple interconnects and leadership in industry standards such as USB and the recently announced Compute Express Link (CXL) open interconnect technology can drive the entire ecosystem Accelerate innovation, drive technology evolution, and unlock the creativity of the entire market to deliver higher performance systems and better digital services.