Progress in semiconductor technology leads the way in the development of materials technology, and the advanced packaging market is growing fast.

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/ 2019-04-11 / News

Dongshun Bai pointed out that it is easy to get started with semiconductor materials, but it is difficult to do well. "Semiconductor materials have very high technical requirements for semiconductor materials. You must have multi-domain cross-border knowledge to do well."

After approaching the physical limit, every advancement in semiconductor technology will affect semiconductors. The technical development direction of the branch field. The 7 nm manufacturing process introduces EUV (Extreme Ultraviolet Light) equipment, which must match the corresponding photoresist for the EUV manufacturing process.

"The most important thing in lithography is the three-light, that is, the lithography machine, the light source and the photoresist. These three lights are all done, and there is nothing special about lithography. “Street,” said Stanley Wong, director of Asian operations at Brewer Science, who told Discover Technology that “three lights” in the lithography process are not easy.Taking a photoresist reflective coating as an example, if a light source illuminates on a substrate, it will cause standing waves, which will result in a line that is not straight during etching. "In the 0.5 micron process era, reflective is acceptable. However, after the 0.25 micron, 0.18 micron or 90 nanometer process, if the reflective control is not good, the lithography process cannot be completed."

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Brewer Science's main business

Brewer Science originally started with anti-reflective coatings (ARC) in photoresist, from the most basic anti-reflection,To wet ARF, dry ARF, and multilayer materials (Multilayer). “The hottest thing in the industry is EUV. We have spent a lot of time on EUV, and even employees are stationed at IMEC to work with the world's most advanced semiconductor R&D institutions to develop EUV technology.”

Wang Shiwei said that in addition to EUV lithography materials, Brewer Science is also developing another technology path, DSA (Direct Self-Assembly), the EUV process has been mass-produced, but Whether it is a machine or a material, it is very expensive, and DSA is a relatively low-cost solution. Of course, the problem with DSA is that the ecology is not as complete as EUV. There are not many customers who are willing to invest in DSA. However, there are still some customers who are exploring the feasibility of DSA with Brewer Science. "The largest company in the United States is still working. We cooperate with the development of DSA. We have invested a lot of resources in EUV, but if EUV encounters some problems,DSA can also be used as an option, eggs can not be placed in a basket, this is our idea, this product (DSA) has basically proved to be feasible so far. "Wang Shiwei said.

Brewer Science employees receive the Best Young Engineer Paper Award

The development of semiconductor technology has also led to a closer integration between wafer fabrication and packaging testing. Brewer Science has invested heavily in packaging material development in recent years.Brewer Science has added some key products and services to its advanced packaging solutions portfolio. The BrewerBOND® T1100 and BrewerBOND® C1300 series materials combine Brewer Science's first complete, two-layer temporary bonding and debonding system. BrewerBUILDTM thin spin-on packaging materials are specifically designed for redistribution layer (RDL) – the first fan-out wafer level package (FOWLP), and Brewer Science expects more Chinese companies to begin exploring the process in the near future.

According to Dongshun Bai, vice president of business development for wafer-level packaging materials at Brewer Science, Brewer Science has been in the packaging industry for more than 15 years. Beginning around 2000, Brewer Science foresees that one of the future directions for semiconductors is advanced packaging, with a range of materials suitable for wafer-level advanced packaging.For example, Chemical Release, Thermal Slide Release, Mechnical Release, Laser Release, and double layer Dual-layer Adhesive Mechnical Release. Different de-bonding technologies, corresponding to different applications, "different customers may be doing the same product, but the process route is different, so each customer's needs are new challenges for Brewer Science, we must according to the specific needs of the product To adjust the materials to ensure the performance of customer demand. In advanced packaging, each application has its own special material process, which is very important in advanced packaging," said Dongshun Bai.

Dongshun Bai said,The bonding/debonding technology of wafer level packaging is facing more and more challenges. For example, wafers are getting thinner and thinner, traditional wafers are thinned to 100 microns, but 50 microns are becoming more common, and even some products require thicknesses below 20 microns, which requires a finer bonding process to prevent wafer breakage. .

"Temporary Bonding sounds simple, but in fact the technical requirements and the requirements of the manufacturing process behind it are endless, it is a very challenging The main challenges are three. One is the stress generated in the processing engineering, including mechanical stress and thermal stress; the second is to have excellent chemical resistance; the third is excellent chemical compatibility. Overall, temporary bonds The requirements for the materials are very high.” Dongshun Bai pointed out that it is easy to get started with semiconductor materials, but it is very difficult to do well. “Semiconductor materials have very high technical requirements. To do semiconductor materials, we must have multi-domain cross-border knowledge. Do it well."

Keywords: Chip semiconductor
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