In Microsemis Powermite® surface mount package, these zener diodes provide power-handling capabilities found in larger packages. In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.
· Surface Mount Packaging
· Integral Heat Sink Locking Tabs
· Compatible with automatic insertion equipment
· Full metallic bottom eliminates flux entrapment
· Zener voltage 1.8 to 100V
· Low noise
· Low reverse leakage current
· Tight tolerance available
Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
Microsemi is now a subsidiary of Microchip Technology Inc.