Homedatasheet1N3035BUR-1

1N3035BUR-1 Datasheet

Surface Mount 1.5 W GLASS ZENER DIODES
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Description

DESCRIPTION
This surface mountable zener diode seriesis similar to the 1N3016 thru 1N3051 JEDEC registrationin the DO-13 package except that it meets the surface mount DO-213AB outline. It is an ideal selection for applications of high density and low parasitic requirements. Due to its glass hermetic seal
qualities andmetallurgically enhanced internal construction, it is also well suited for high-reliability applications.

FEATURES
•  Leadless surface mount package equivalents to the JEDEC registered 1N3016 thru1N3051except with higher power rating of 1.5 Watts
•  Ideal for high-density mounting
•  Voltage range: 6.8 to 200 volts
•  Hermetically sealed, double-slug glass construction
•  Metallurgically enhanced contact construction.
•  Options for screening inaccordance with MIL-PRF-19500/115 for JAN, JANTX, JANTXV, and JANS
with MQ, MX, MV, or MSP prefixes respectively for part numbers, e.g. MX1N3016BUR-1,
MV1N3051BUR-1, etc.
•  Axial lead “thru-hole” DO-13 packages per JEDEC registration available as 1N3016B thru 1N3051B (see separate data sheet withMIL-PRF-19500/115 qualification)

APPLICATIONS/ BENEFITS
•  Regulates voltage over a broad operating current and temperature range
•  Wide selection from 6.8 to 200V
•  Tight voltage tolerances available
•  Lowreverse (leakage) currents
•  Leadless package for surfacemounting
•  Ideal for high-density mounting
•  Metallurgically enhanced internal contact design for greater reliabilityand lower thermal resistance
•  Nonsensitive to ESD
•  Hermetically sealed glass package
•  Specified capacitance (seeFigure 2)
•  Inherentlyradiation hard as described in Microsemi MicroNote 050

Features

Parameters


Manufacturer information

MICROSEMI CORPORATION

Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

Microsemi is now a subsidiary of Microchip Technology Inc.


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