. Plastic MINI MELF package.
. Glass passivated chip junction.
. 150W peak pulse power capability with a 10/1000µs waveform ,repetition rate(duty cycle): 0.01%.
. Excellent clamping capability.
. Very fast response time.
. Low incremental surge resistance.
. Typical ID less than 1mA above 10V rating
. High temperature soldering guaranteed: 250℃/10 seconds of terminal