| Features, Applications |
FEATURES Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 �s) Eliminates wire bonding No overshoot Provides optimum voltage clamping Max Junction Temperature: 1750C Storage Temperature: to +1750C Flip Chip Peak Pulse Power: 5000 Watts (10/1000 �s) Maximum non-repetitive peak power 5000 Watts (10/1000 �s) Total continuous power dissipation @ Tlead 10 W Turn-on time (theoretical) unidirectional 1X10-12 Turn-on time (theoretical) bidirectional 1X10-9 Weight: 0.8 grams (approximate) Cathode mark on top side Metallization - Au (Both Sides)BIDIRECTIONAL ALL DIMENSIONS NOMINAL FLIP CHIP DIMENSIONS PAD SIZE & CIRCUIT POWER DERATING PEAK PULSE POWER Vs PULSE TIME Maximum Clamping Voltage @IPP (1 mSEC) VC Volts Maximum Voltage Temperature Variation of V(BR) mV/�C For bidirectional devices add a "C" (example CHF5KP6.8C and CHF5KP6.8CA are bidirectional devices) "A" designates � 5% tolerance; plain designates � 10% tolerance MSC0997.PDF |
Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
Microsemi is now a subsidiary of Microchip Technology Inc.
