SST39VF3201 Datasheet



The SST39VF3201 devices are 2M x16 CMOS Multi-Purpose Flash Plus (MPF+) manufactured with SST’s proprietary,high-performance CMOS SuperFlash technology.The split-gate cell design and thick-oxide tunneling injectorattain better reliability and manufacturability compared withalternate approaches. The SST39VF320xB write (Programor Erase) with a 2.7-3.6V power supply. Thesedevices conform to JEDEC standard pin assignments forx16 memories.Featuring high performance Word-Program, theSST39VF320xB devices provide a typical Word-Programtime of 7 μsec. These devices use Toggle Bit or Data# Pollingto indicate the completion of Program operation. To protectagainst inadvertent write, they have on-chip hardwareand Software Data Protection schemes. Designed, manufactured,and tested for a wide spectrum of applications,these devices are offered with a guaranteed typical enduranceof 100,000 cycles. Data retention is rated at greaterthan 100 years.The SST39VF320xB devices are suited for applications thatrequire convenient and economical updating of program,configuration, or data memory. For all system applications,they significantly improve performance and reliability, whilelowering power consumption. They inherently use lessenergy during Erase and Program than alternative flashtechnologies. The total energy consumed is a function ofthe applied voltage, current, and time of application. Sincefor any given voltage range, the SuperFlash technologyuses less current to program and has a shorter erase time,the total energy consumed during any Erase or Programoperation is less than alternative flash technologies. Thesedevices also improve flexibility while lowering the cost forprogram, data, and configuration storage applications.The SuperFlash technology provides fixed Erase and Programtimes, independent of the number of Erase/Programcycles that have occurred. Therefore the system softwareor hardware does not have to be modified or de-rated as isnecessary with alternative flash technologies, whose Eraseand Program times increase with accumulated Erase/Programcycles.To meet high-density, surface mount requirements, theSST39VF320xB devices are offered in 48-lead TSOP and48-ball TFBGA packages. See Figure 2 and Figure 3 forpin assignments. SST39VF3201 Features • Organized as 2M x16• Single Voltage Read and Write Operations– 2.7-3.6V• Superior Reliability– Endurance: 100,000 Cycles (Typical)– Greater than 100 years Data Retention• Low Power Consumption (typical values at 5 MHz)– Active Current: 6 mA (typical)– Standby Current: 4 μA (typical)– Auto Low Power Mode: 4 μA (typical)• Hardware Block-Protection/WP# Input Pin– Top Block-Protection (top 32 KWord)for SST39VF3202B– Bottom Block-Protection (bottom 32 KWord)for SST39VF3201B• Sector-Erase Capability– Uniform 2 KWord sectors• Block-Erase Capability– Uniform 32 KWord blocks• Chip-Erase Capability• Erase-Suspend/Erase-Resume Capabilities• Hardware Reset Pin (RST#)• Security-ID Feature– SST: 128 bits; User: 128 words• Fast Read Access Time:– 70 ns• Latched Address and Data• Fast Erase and Word-Program:– Sector-Erase Time: 18 ms (typical)– Block-Erase Time: 18 ms (typical)– Chip-Erase Time: 35 ms (typical)– Word-Program Time: 7 μs (typical)• Automatic Write Timing– Internal VPP Generation• End-of-Write Detection– Toggle Bits– Data# Polling• CMOS I/O Compatibility• JEDEC Standard– Flash EEPROM Pin Assignments• Packages Available– 48-lead TSOP (12mm x 20mm)– 48-ball TFBGA (6mm x 8mm)• All non-Pb (lead-free) devices are RoHS compliant


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Manufacturer information


Diodes Incorporated is a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets. Diodes serves the consumer electronics, computing, communications, industrial, and automotive markets.
Diodes’ products include diodes, rectifiers, transistors, MOSFETs, protection devices, function-specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors, power management devices, including LED drivers, AC-DC converters and controllers, DC-DC switching and linear voltage regulators, and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers.
Diodes’ corporate headquarters and Americas’ sales office are located in Plano, Texas and Milpitas, California. Design, marketing, and engineering centers are located in Plano; Milpitas; Taipei, Taiwan; Taoyuan City, Taiwan; Zhubei City, Taiwan; Manchester, England; and Neuhaus, Germany. Diodes’ wafer fabrication facilities are located in Manchester and Shanghai, China. Diodes has assembly and test facilities located in Shanghai, Jinan, Chengdu, and Yangzhou, China, as well as in Hong Kong, Neuhaus and Taipei. Additional engineering, sales, warehouse, and logistics offices are located in Taipei; Hong Kong; Manchester; Shanghai; Shenzhen, China; Seongnam-si, South Korea; and Munich, Germany, with support offices throughout the world.

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