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PCB machine that an electronic engineer need to know
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/ 2018/7/31 13:40:52 / PCB

About CNC Drilling

For numerous industries, precision and productivity are top priorities. With the introduction of computer numerical control (CNC) for metal drilling applications, companies across the board can achieve both when drilling holes or other shapes at a set diameter and length, providing their products or equipment with a universal set of components that ensure safety, performance and reliability for all users.

 CNC Drilling

How CNC Drilling Works

Several types of drilling machines are available for CNC, including these drill presses:

  • Upright

  • Bench

  • Radial

Our 22,000-square-foot facility features each, which include a few distinctive features and operations, but share the following components:

Spindle: Secures the chuck and drill bit, which can range from a spade to an ejector bit.

Table: Provides the workspace for the drilling machine, displaying the material receiving work.

Column: Supports the CNC drilling machine's elements.

Drill bit: Drills the necessary holes into a material.

Interface: Controls the drilling machine's operation through operator inputs.

When in use, the step-by-step process for CNC drilling includes:

  • The spindle lowers, drilling the appropriate hole sizes and diameters.

  • After the drilling machine has completed its process, the operator reviews the material for any imperfections

  • The operator uploads and accesses the computer-aided design (CAD) or computer-aided manufacturing (CAM) file.

  • The operator installs the appropriate drill bit and secures the designated material on the table.

  • The operator starts the drilling process through the control panel or interface.

 

Applications of CNC Drilling Machines

The use of CNC drilling machines varies, but can include the following products:

  • Gear blanks

  • Hubs

  • Aluminum profiles

  • Plastic profiles

  • Machined shafts

 

Advantages and Disadvantages of CNC Drilling Machines

Following their introduction to the industry, drilling machines with CNC technology have delivered several benefits:

Reproducibility: A continuous challenge for companies across markets is producing identical batches of products. This hurdle becomes amplified for custom machining projects. With CNC, however, those challenges are solved, leading to a consistent, imperfection-free production line.

Many drilling machines are also easy-to-use for operators, reducing the chance of errors.

Versatility: It's a significant advantage that CNC drilling machines are capable of accepting multiple bits. While operators may need to use a different type of drilling machine, they can equip that machine with a series of bits. Some machine types include a tool turret for even faster shuffling between bits.

Accuracy: The precision offered by CNC is unmatched. It has provided companies in all industries with many returns, including raised productivity, lowered expenses and optimized production lines.

Disadvantages: -


About VCP Electroplating Machine

Electroplating machine operators set up and tend electroplating machines designed to finish and coat the metal workpieces' (such as future pennies and jewelry) surface by using electric current to dissolve metal cations and to bond a thin layer of another metal, such as zinc, copper or silver, to produce a coherent metal coating to the workpiece's surface.

VCP Electroplating Machine

The skill that a VCP Electroplating Machine should hold

Monitor electroplating baths: Control the temperature and changing composition of the solution composed of different chemical components and used to cover a surface with a thin layer of metal.

Remove inadequate workpieces: Evaluate which deficient processed workpieces do not meet the set-up standard and should be removed and sort the waste according to regulations.

Tend electroplating machine: Tend a metalworking machine designed to coat metal surfaces by using electric current to form metal coatings on an electrode and on the workpiece, monitor and operate it according to regulations.

Troubleshoot: Identify operating problems, decide what to do about it and report accordingly.

Wear appropriate protective gear: Wear relevant and necessary protective gear, such as protective goggles or other eye protection, hard hats, safety gloves.

Remove processed workpiece: Remove individual workpieces after processing, from the manufacturing machine or the machine tool. In case of a conveyor belt this involves quick, continuous movement.

Ensure equipment availability: Ensure that the necessary equipment is provided, ready and available for use before start of procedures.

Supply machine:  Ensure the machine is fed the necessary and adequate materials and control the placement or automatic feed and retrieval of work pieces in the machines or machine tools on the production line.

 

Knowledge relevant to VCP Electroplating Machine

Electric current: Flow of electric charge, carried by electrons or ions in a medium such as an electrolyte or a plasma.

Electroplating processes: The various metalworking processes using electric current to form metal coating on an electrode and on the workpiece, such as pulse electroplating, pulse electrodeposition, brush electroplating, and others.

Types of metal: Qualities, specifications, applications and reactions to different fabricating processes of various types of metal, such as steel, aluminium, brass, copper and others.

Electroplating machine parts: The various parts of a metalworking machine using electroplating processes to provide coating to workpieces, such as the plating barrel, plating line, borehole, battery charger, and others.

Health and safety in the workplaceThe body of rules, procdeures and regulations related to safety, health and welfare of people in their workplace.

Electroplating metal materials:The various processes various materials used for electroplating may produce, such as copper plating, silver plating, nickle plating, gold plating, embossed gold plating, degreasing, and others.

Quality standards:The national and international requirements, specifications and guidelines to ensure that products, services and processes are of good quality and fit for purpose.

 

About LID exposer

First of all,do you know what is LID? LID (Light Induced Degradation) is a loss of performance observed with crystalline silicon modules, beginning in the very first hours of their exposure to the sun. As its name suggests, it affects real performance compared with the final factory flash tests data delivered by the PV module provider.LID is caused by traces of oxygen included in the molten silicon during the Czochralski process for obtaining silicon crystals. Due to the light exposure effect, these positive-charged O2 dimers may diffuse across the silicon lattice and create complexes with boron dopant acceptors. The boron-oxygen complexes create their own energy levels in the silicon lattice, and can capture electrons and holes which thus become unavailable for the PV effect.LID is a well-known and widespread effect; accordingly, sophisticated simulation software such as PV-SYST explicitly provides a variable for it when simulating the performance of a PV solution consisting of c-Si modules, even including the suggestion of a default value.

LID exposer

About DES line

DES line

Features of DES line

This line is to form the patterns on the panels by chemical treatment, whose configuration is Developing + Etching + Stripping. Developing and Etching module with our rotary spray system are readily achievable high etching factor to a fine pattern. It can be used a chemical, CuCl2 and FeCl2.


Application of DES line

  • Turn clockwise conveyor drive motor

  • Power distribution box

  • Worm drive

  • Tru-Union diaphragm valves on process pump

  • Removable tin anode basket

  • Typical back side of conveyorized process line

  • PVA roller storage

  • Hinged lids with tempered glass

  • PVA roller storage

  • Hinged lids with tempered glass

 

About Flying Probe Tester

As the trend in the increase of board complexity continues, the capabilities of automated test equipment or in-circuit testers are challenged and even exceeded. This could be due to the lack of or limited physical access (test points) to components or, limited tester channels or, the cost of fixture design and fabrication, especially for large node count boards. Flying probe test systems require no test fixturing, have few restrictions on board access, and can test boards with virtually unlimited number of nets. These systems also allow developers to complete test programs in a short time.

Flying probe machine

Types of Flying Probe

A. First Generation FP – starting mid 1990s in N.A.

• Single Sided with flying probes on the top side only

• Four angled Flying Probes on top side

• Manually placed (Fixed) Probes on bottom side

B. Second Generation FP – starting mid 2000s in N.A.

• Double Sided with angled flying probes on the top and bottom side

• Four angled Flying Probes on top side

• Two Flying Probes on bottom side

C. Third Generation FP – two suppliers W.W.

• Double Sided with flying probes on the top and bottom side

• Four or more Flying Probes on top side

• Four or more Flying Probes on bottom side

• Incorporate complementary technologies such as Boundary Scan, Thermal

D. Other FP types

• One and/or two Flying probes from one side for diagnosing defects

• Backplane testing using connectors

• Bareboard Flying Probers for testing bare PCBs without components

 

Advantages of Flying Probe Test

  • Eliminates fixturing costs and time

  • Fast test program development, easy integration of design changes

  • Process flexibility

  • Circuit access, even in the absence of test points

  • Controlled probe contact, programmable for any type of board

  • Different test solutions and approaches integrated in a single test system

  • Intrinsic positioning and measurement precision

 

Application of Flying Probe test

  • New PCBAs for NPI, prototype and low volume testing

  • Connector testing

  • Backplane testing

  • Field returns

  • Reverse Engineering

  • Battery

  • Continuity (Link) testing

  • Substrate testing

  • Load Board testing

  • Fault Injection

  • Copper plating measurement

  • Wafer testing

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