The is an epoxy encapsulated electromagnetic/ electrostatic interference (EMI) shield for use with circuits where sensitivity to EMI is critical. It was designed to attenuate EMI by converting electromagnetic field energy into heat that is absorbed by the shield and by shunting electrostatic fields to common. The 100MS may be used in applications to either confine or exclude EMI. Its cavity was designed for 7.24mm, 20-pin hybrid packages. The shields in the cover and base plate are in two separate halves to maintain the electrical isolation between the adjacent rows of pins of the module it encloses. Because of the spacing between the shield halves and epoxy flow holes, the 100MS provides a partial, but adequate low reluctance path for electromagnetic flux. The 100MS is well suited for use with isolation modules such as the Burr-Brown 3656, 722, and 724. over the module so the tabs are aligned and fit into the slots in the base plate. Bend the four wide shield soldering tabs protruding from the cover to make contact with the bare metal on the base plate. Solder these four tabs to insure the integrity of their connection to the base plate. The 100MS and the module it contains are mounted and secured to a printed circuit board (PCB) by soldering the two narrow PCB solder tabs to the appropriate common. The PCB solder tab closest to the input side of the module should be soldered to the input common. The other tab should be soldered to the output common. Figure 2 illustrates the assembly of the 100MS.
Assemble the base plate to the module by pushing the pins of the module through the beveled holes in the base plate until the base plate and bottom of the module are in contact with each other. Place the cover
Base Plate Shield VISO Connection to Input Common VISO = Isolation Voltage Connection to Output Common
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Specifications apply between solder tabs. 100MS PARAMETER Isolation Voltage Rated Continuous, DC Rated Continuous, AC Test Capacitance Resistance Leakage Current CONDITIONS MIN TYP MAX UNITS VDC Vrms VDC pF �A
NOTE: Temperature changes (T/t) greater than 1�C per minute below 0�C and long term storage above 100�C are not recommended.MODEL 100MS PACKAGE EMI Shield PACKAGE DRAWING NUMBER 124
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix D of Burr-Brown IC Data Book.
MULTIPLE DEVICE ORIENTATION A typical application for the 100MS is shown in Figure 3. Using multiple devices within 30mm of each other can cause them to interact by forming beat frequency interference outputs. The 100MS can reduce this interference by as much as a factor of 200:1 depending on the distance between the devices and their relative orientation. Minimum EMI results when the gaps of both shields are paralleled as in Figure 3a.FIGURE 3a. Optimum PCB Layout. Orientation for minimum EMI.
FIGURE 3b. Isolated Data Acquisition Input Circuitry. Orientation for Minimum EMI.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
ORDERABLE DEVICE 0100MS STATUS(1) ACTIVE PACKAGE TYPE PDIP PACKAGE DRAWING NSP PINS 20 PACKAGE QTY 25
(1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.