Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Available in ammo-pack.
Philips Semiconductors was acquired by NXP Semiconductors.
NXP Semiconductors, formerly Philips Semiconductors, has fifty years of innovation and a rich IP portfolio that firmly establishes NXP as Europe's second largest semiconductor company.