• 1N4099UR-1 THRU 1N4135UR-1 AVAILABLE IN JAN, JANTX, JANTXV AND JANS PER MIL-PRF-19500/435
• LEADLESS PACKAGE FOR SURFACE MOUNT
• LOW CURRENT OPERATION AT 250 µA
• METALLURGICALLY BONDED
Junction and Storage Temperature: -65°C to +175°C
DC Power Dissipation: 500mW @ TEC= +125°C
Power Derating: 10mW/ °C above TEC= +125°C
Forward Derating @ 200 mA: 1.1 Volts maximum
Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
Microsemi is now a subsidiary of Microchip Technology Inc.