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DESIGNER'S DATA SHEET FEATURES: � Low Profile Ceramic SMD � High Surge Rating � Low Reverse Leakage Current � Low Forward Voltage � Seam Welded Package � Low Capacitance � Ultrasonic Aluminum Wire Bonds60 VOLTS, 10 AMP DUAL SCHOTTKY COMMON CATHODE CENTERTAP RECTIFIER
Average Rectified Forward Current (Resistive Load, 60Hz, Sine Wave, = 25oC) Peak Surge Current (8.3 ms Pulse, = 25oC, per leg) IFSM 200 Amps
Operating & Storage Temperature Maximum Thermal Resistance Junction to Case, each individual diode Junction to Case Note 1 Note 1: Both legs tied together 11/1199
Instantaneous Forward Voltage Drop (IF = 3 Adc, 25C, 300us Pulse (IF = 10 Adc, = 25 oC, 300�s Pulse) (IF = 15 Adc, = 25 oC, 300�s Pulse) Instantaneous Forward Voltage Drop (IF = 10 Adc, = 100 oC, 300�s Pulse) (IF = 15 Adc, = 100 oC, 300�s Pulse) Reverse Leakage Current (Rated VR, 25oC, 300�s pulse minimum) Reverse Leakage Current (Rated VR, = 100 oC, 300�s pulse minimum) Junction Capacitance = 25 oC, = 1 MHz)
Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
Microsemi is now a subsidiary of Microchip Technology Inc.