FEATURES Ultra high switching speed Very low capacitance High breakdown voltage Leadless ultra small plastic package � 0.5 mm) Boardspace 1.17 mm2 (approx. of SOT23) Power dissipation comparable to SOT23. APPLICATIONS Ultra high-speed switching High frequency applications Mobile communication, digital (still) cameras, PDAs and PCMCIA cards.
DESCRIPTION An epitaxial Schottky barrier diode encapsulated a SOD882 leadless ultra small plastic package. ESD sensitive device, observe handling precautions.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VR IF Tstg Tj continuous reverse voltage continuous forward current storage temperature junction temperature PARAMETER MIN. MAX. mA �C UNIT
ELECTRICAL CHARACTERISTICS Tamb 25 �C unless otherwise specified. SYMBOL IR Cd Note 1. Pulse test: pulse width = 300 �s; = 0.02. THERMAL CHARACTERISTICS SYMBOL Rth j-a Note 1. Refer to SOD882 standard mounting conditions (footprint), FR4 with 60 �m copper strip line. Soldering Reflow soldering is the only recommended soldering method. 2003 May 15 2 PARAMETER thermal resistance from junction to ambient note 1 CONDITIONS VALUE 500 UNIT K/W PARAMETER forward voltage reverse current diode capacitance CONDITIONS = 2 mA; see Fig.2; note 40 V; see Fig.3; note = 1 MHz; see 1 0.6 MAX. 800 UNIT �A pFForward current as a function of forward voltage; typical values.
Reverse current as a function of reverse voltage; typical values.
Diode capacitance as a function of reverse voltage; typical values.