High speed performance 120 ns access time available CMOS Technology for low power consumption 20 mA Active current 100 �A Standby current Factory programming available Auto-insertion-compatible plastic packages Auto ID aids automated programming Separate chip enable and output enable controls High speed "express" programming algorithm Organized x 8: JEDEC standard pinouts - 28-pin Dual-in-line package - 32-pin PLCC Package - 28-pin SOIC package - Tape and reel Available for the following temperature ranges - Commercial: +70�C - Industrial: to +85�CDESCRIPTION
The Microchip Technology Inc. is a CMOS 64K bit (electrically) Programmable Read Only Memory. The device is organized as 8K words by 8 bits (8K bytes). Accessing individual bytes from an address transition or from power-up (chip enable pin going low) is accomplished in less than 120 ns. CMOS design and processing enables this part to be used in systems where reduced power consumption and high reliability are requirements. A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC or SOIC packaging is available. Tape and reel packaging is also available for PLCC or SOIC packages.
Function Address Inputs Chip Enable Output Enable Program Enable Programming Voltage Data Output +5V Power Supply Ground No Connection; No Internal Connections Not Used; No External Connection Is Allowed
VCC and input voltages w.r.t. VSS....... + 7.25V VPP voltage w.r.t. VSS during programming.......................................... to +14V Voltage on A9 w.r.t. VSS...................... to +13.5V Output voltage w.r.t. VSS............... -0.6V to VCC +1.0V Storage temperature.......................... to +150�C Ambient temp. with power applied..... to +125�C
*Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Parameter Input Voltages Input Leakage Output Voltages Output Leakage Input Capacitance Output Capacitance Power Supply Current, ActiveStatus Logic "1" Logic "0" Logic "1" Logic "0" TTL input TTL input
VIN 0 to VCC IOH -400 �A IOL 2.1 mA VOUT 0V to VCC VIN = 0V; Tamb = 1 MHz VOUT = 0V; Tamb = 1 MHz VCC = 5.5V; VPP = VCC; = 1 MHz; CE = VIL; IOUT = 0 mA; VIL to 0.8V; VIH 2.0 to VCC; Note 1Power Supply Current, Standby IPP Read Current VPP Read Voltage
TTL input TTL input CMOS input Read Mode Read Mode
* Parts: C=Commercial Temperature Range; I =Industrial Temperature Range.
Note 1: Typical active current increases.5 mA per MHz up to operating frequency for all temperature ranges.
AC Testing Waveform: Output Load: Input Rise and Fall Times: Ambient Temperature: 27C64-12 Parameter Address to Output Delay CE to Output Delay OE to Output Delay OE to O/P High Impedance Output Hold from Address CE or OE, whichever occurs first Sym Min Max Min Max Min Max Min Max Min Max tACC tCE tOE tOFF tOH OE = VIL OE = VIL CE = VIL VIH = 2.4V and VIL = 0.45V; VOH = 2.0V VOL 0.8V 1 TTL Load 10 ns Commercial: Tamb to +70�C Industrial: Tamb 27C64-20 27C64-25 Units Conditions
Note 1: tOFF is specified for OE or CE, whichever occurs first. 2: OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 3: This parameter is sampled and is not 100% tested.