Chip type 2C2484 by Semicoa Semiconductors provides performance similar to these devices.
Product Summary: APPLICATIONS: Designed for high speed switching applications. Features: High speed switching capabilities
Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base 19.5 k� min. 6.5 k� nom. 3.6 mils diameter 2.5 mils diameter 8 mils nominal 18 mils x 18 mils Silox Passivated
hFE 100 �A dc, VCE V 175 ----Due to limitations of probe testing, only dc parameters are tested. This must be done with pulse width less than 300 �s, duty cycle less than 2%.