Homedatasheet2SB928

2SB928 Datasheet

V<SUB>CEO</SUB>(V) = -150 ;; I<SUB>C</SUB>(A) = -2 ;; HFE(min) = 60 ;; HFE(max) = 240 ;; Package = N-A1N-G1
Share:
Manufacturer

Description

Features, Applications

For Power amplification For TV vertical deflection output Complementary to 2SD1250 and 2SD1250A Features

High collector-emitter voltage (Base open) VCEO High collector power dissipation PC N type package enabling direct soldering of the radiating fin to the printed circuit board, etc. of small electronic equipment.

Parameter Collector-base voltage (Emitter open) Collector-emitter voltage 2SB0928 (Base open) 2SB0928A VEBO IC ICP 25�C Tj Tstg Symbol VCBO VCEO Rating �C Unit V

Emitter-base voltage (Collector open) Collector current Peak collector current Collector power dissipation Junction temperature Storage temperature

Note) Self-supported type package is also prepared

Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) 2SB0928 2SB0928A VEBO ICBO IEBO * hFE2 Base-emitter voltage Collector-emitter saturation voltage Transition frequency VBE VCE(sat) = -500 �A, = 0 VCB = 0 VEB = 0 VCE -150 mA VCE -400 mA VCE = -500 mA, -50 mA VCE = 10 MHz V MHz Symbol VCBO VCEO Conditions = -500 �A, = -5 mA, = 0 Min V �A Typ Max Unit V

Emitter-base voltage (Collector open) Collector-base cutoff current (Emitter open) Emitter-base cutoff current (Collector open) Forward current transfer ratio

Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. Rank classification Rank to 240 Note) The part numbers in the parenthesis show conventional part number.




Request for your special attention and precautions in using the technical information and semiconductors described in this material

(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.


Features

Parameters

Download DataSheet PDF View and Download


Manufacturer information

Warm Hint

What HQEW.NET can offer here?
1. www.hqew.net/product-data provides numerous and various electronic part data-sheet and technology document here., if it can't be shown, Please feel free to ask us for it.
2. www.hqew.net/news provides the latest information of the semiconductor industry or the electronics industry for you.
3. www.hqew.net provides verified suppliers and numerous electronic components for your demand and business.
Any questions you can contact us by email cs@hqew.net.
related datasheet
Browse Alphabetically: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0 1 2 3 4 5 6 7 8 9
Contact Us

+86-755-83536845

One to One Customer Service

17190417227