Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications Technical DataFeatures
Dual Marked with Device Part Number and DSCC Drawing Number Manufactured and Tested a MIL-PRF-38534 Certified Line QML-38534, Class H and K Five Hermetically Sealed Package Configurations Performance Guaranteed, Over to +125�C High Speed: Typically 400 kBit/s 9 MHz Bandwidth Open Collector Output 2-18 Volt VCC Range 1500 Vdc Withstand Test Voltage High Radiation Immunity HCPL-2530/ -2531, Function Compatibility Reliability Data
Analog Signal Ground Isolation (see Figures 7, 8, and 13) Isolated Input Line Receiver Isolated Output Line Driver Logic Ground Isolation Harsh Industrial Environments Isolation for Test Equipment Systems
improve the speed to a hundred times that of a conventional phototransistor optocoupler by reducing the base-collector capacitance. These devices are suitable for wide bandwidth analog applications, as well as for interfacing TTL to LSTTL or CMOS. Current Transfer Ratio (CTR) is 9% minimum = 16 mA. The 18 V VCCDescription
These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level or K testing or from the appropriate DSCC Drawing. All devices are manufactured and tested a MIL-PRF-38534 certified line and are included in the DSCC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits. Each channel contains a GaAsP light emitting diode which is optically coupled to an integrated photon detector. Separate connections for the photodiodes and output transistor collectorsApplications
Military and Space High Reliability Systems Vehicle Command, Control, Life Critical Systems Line Receivers Switching Power Supply Voltage Level Shifting
The connection � F bypass capacitor between VCC and GND is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
capability will enable the designer to interface any TTL family to CMOS. The availability of the base lead allows optimized gain/ bandwidth adjustment in analog applications. The shallow depth of the IC photodiode provides better radiation immunity than conventional phototransistor couplers. These products are also available with the transistor base node connected to improve common mode noise immunity and ESD susceptibility. In addition, higher CTR minimums are available by special request.
Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P and E respectively), 16 pin DIP flat pack (case outline F), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options, see Selection Guide Table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. Because the same functional die (emitters and detectors) are used for each channel of each device
listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part's performance for die related reliability and certain limited radiation test results.Selection Guide�Package Styles and Lead Configuration Options
Package Lead Style Channels Common Channel Wiring Agilent Part # & Options Commercial MIL-PRF-38534, Class H MIL-PRF-38534, Class K Standard Lead Finish Solder Dipped Butt Cut/Gold Plate Gull Wing/Soldered Class H SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered
16 Pin DIP Through Hole 2 None 4N55/883B HCPL-257K Gold Plate Option #200 Option #100 Option 8767905KUA 8767905KTA
8 Pin DIP Through Hole 1 None HCPL-5501 HCPL-550K Gold Plate Option #200 Option #100 Option 9085401KYA 9085401KXA
8 Pin DIP Through Hole 2 VCC GND HCPL-5531 HCPL-553K Gold Plate Option #200 Option #100 Option 8767906KYA 8767906KXA16 Pin Flat Pack Unformed Leads 4 VCC GND HCPL-6551 HCPL-655K Gold Plate
20 Pad LCCC Surface Mount 2 None HCPL-6531 HCPL-653K Solder Pads
Note: 8 pin DIP and flat pack devices have common VCC and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages have isolated channels with separate VCC and ground connections.