Members of the Texas Instruments Widebus TM Family Inputs are TTL-Voltage Compatible Flow-Through Architecture Optimizes PCB Layout Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise EPIC TM (Enhanced-Performance Implanted CMOS) 1-�m Process Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacingsdescription
The 'ACT16623 are 16-bit transceivers designed for asynchronous two-way communication between data buses. The control-function implementation allows for maximum flexibility in timing. These devices can be used as two 8-bit transceivers or one 16-bit transceiver. They allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the output-enable (OEBA and OEAB) inputs. The output-enable inputs can be used to disable the device so that the buses are effectively isolated.
The dual-enable configuration gives the bus transceiver the capability to store data by simultaneously enabling OEBA and OEAB. Each output reinforces its input in this transceiver configuration. When both control inputs are enabled and all other data sources to the two sets of bus lines are at high impedance, the bus lines remain at their last states. The 74ACT16623 is packaged in TI's shrink small-outline package, which provides twice the functionality of standard small-outline packages in the same printed-circuit-board area. The 54ACT16623 is characterized for operation over the full military temperature range to 125�C. The 74ACT16623 is characterized for operation from to 85�C.
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UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303
FUNCTION TABLE (each 8-bit section) INPUTS OEBA OEAB OPERATION B data to A bus A data to B bus Isolation B data to A bus, A data to B busThis symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC. 7 V Input voltage range, VI (see Note V to VCC 0.5 V Output voltage range, VO (see Note V to VCC 0.5 V Input clamp current, IIK (VI VI > VCC). �20 mA Output clamp current, IOK (VO VO > VCC). �50 mA Continuous output current, IO (VO 0 to VCC). �50 mA Continuous current through VCC or GND. �400 mA Maximum power package dissipation = 55�C (in still air) (see Note 2): DL package. 1.2 W Storage temperature range, Tstg. to 150�C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150�C and a board trace length of 750 mils.
54ACT16623 MIN VCC VIH VIL VI VO IOH IOL t/v Supply voltage (see Note 4) High-level input voltage Low-level input voltage Input voltage Output voltage High-level output current Low-level output current Input transition rise or fall rate VCC NOM 5 MAX 5.5 74ACT16623 MIN 2 0.8 VCC NOM 5 MAX 5.5 UNIT mA ns/V �C
TA Operating free-air temperature 125 �40 NOTES: 3. Unused inputs should be connected to VCC through a pullup resistor of approximately k or greater. 4. All VCC and GND pins must be connected to the proper power supply.
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