54F10 Datasheet



Features, Applications

This device contains three independent gates each of which performs the logic NAND function

Package Description (0 300 Wide) Molded Dual-In-Line 14-Lead Ceramic Dual-In-Line (0 150 Wide) Molded Small Outline JEDEC (0 300 Wide) Molded Small Outline EIAJ 14-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C

Note 1 Devices also available in 13 reel Use suffix e SCX and SJX Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB

FAST and TRI-STATE are registered trademarks of National Semiconductor Corporation C1995 National Semiconductor Corporation

If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Plastic VCC Pin Potential to Ground Pin Input Voltage (Note 2) Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) Standard Output TRI-STATE Output Current Applied to Output in LOW State (Max)

Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial

Note 1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Either voltage limit or current limit is sufficient to protect inputs

Symbol VIH VIL VCD VOH Parameter Min Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage Output LOW Voltage Input HIGH Current Input HIGH Current Breakdown Test Output HIGH Leakage Current Input Leakage Test Output Leakage Circuit Current Input LOW Current Output Short-Circuit Current Power Supply Current Power Supply Current

Conditions Recognized as a HIGH Signal Recognized as a LOW Signal

IIN b18 mA IOH b1 mA IOH b1 mA IOH b1 mA IOL 20 mA IOL 20 mA VIN 2 7V VIN 7 0V VOUT e VCC IID 9 mA All other pins grounded VIOD 150 mV All other pins grounded VIN 0 5V VOUT VO e HIGH VO e LOW

74F Symbol Parameter Min tPLH tPHL Propagation Delay 25 C VCC 50 pF Typ 37 32 Max 54F TA VCC e Mil 50 pF Min 20 15 Max 74F TA VCC e Com 50 pF Min 24 15 Max 53 ns Units

The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F Temperature Range Family 74F e Commercial 54F e Military Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline Package SOIC JEDEC SJ e Small Outline Package SOIC EIAJ C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13 reels Temperature Range C e Commercial M e Military 125 C)

20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A



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