1500 WATT PEAK POWER 5.0 WATTS STEADY STATE
Plastic package has underwriters laboratory Glass passivated chip construction 1500 watt surage capability at 1ms Excellent clamping capability Low zener impedance Fast response timeRatings 25 oC ambient temperature unless otherwise specified.
For Bidirectional use or CA suffix for types 1.5FMCJ6.8 thru 1.5FMCJ200 Electrical characteristics apply in both direction
MAXIMUM RATINGS (At 25 oC unless otherwise noted) RATINGS Peak Power Dissipation with 10/1000uS ( Note Fig.1 ) Peak Pulse Current with a 10/1000uS Waveform ( Note Fig.3 ) Steady State Power Dissipation 75oC ( Note 2 ) Peak Forward Surge Current, 8.3ms single half sine wavesuperimmposed on rated load( JEDEC METHOD Note 2,3 ) Maximum Instantaneous Forward Voltage at 50A for unidirectional only ( Note 3,4 ) Operating and Storage Temperature RangeUNITS Watts Amps Watts Amps Volts
NOTES : 1. Non-repetitive current pulse, per Fig.3 and derated above 25 C per Fig.2. 2. Mounted X 8.0mm) copper pads to each terminal. 3. Measured on 8.3mS single half sine-wave or equivaient square wave, duty cycle = 4 pulses per minute maximum. on 1.5FMCJ6.8 thru 1.5FMCJ90 diveces and on 1.5FMCJ100 thru 1.5FMCJ400 devices.PEAK PULSE POWER (PPP) OR CURRENT (IPP) DERATING IN PERCENTAGE,%
FIG. 1 - PEAK PULSE POWER RATING CURVE
FIG. 4 - MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT UNIDIRECTIONAL ONLY 100
Pulse Width (td) is Defined as the Point Where the Peak Current Decays 50% of IPPM
IPPM 2 10/1000usec. Waveform as Defined by R.E.A. HALF VALUE -
5.00 PM(AV), STEADY STATE POWER DISSIPATION, WATTS
FIG. 5 -STEADY STATE POWER DERATING CURVE
Maximum Peak Pulse Current IPPM (Amps)
RECTRON is a leading manufacturer of power semiconductors, offering a comprehensive range of rectifiers including bridge rectifiers, switching diodes, zener diodes, signal transistors and transient voltage suppressors. Product technologies include schottky barrier, ultra fast, super fast, epitaxial, high efficiency, fast recovery, and standard recovery, which is available in a proprietary glass passivated junction construction that significantly increases long term and environmental reliability. All product technologies are produced in a variety of topologies and include axial lead ,SIP, DIP, CASE, surface mount, SOD, SMA, SMB, SMC, DIP, chip & die custom packages.