1N4006G-T Datasheet



Features, Applications


High reliability Low cost Low leakage Low forward voltage drop High current capability Glass passivated junction

Case: Molded plastic Epoxy: Device has UL flammability classification 94V-O Lead: MIL-STD-202E method 208C guaranteed Mounting position: Any Weight: 0.33 gram

Ratings o C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%.

MAXIMUM RATINGS (At 25 oC unless otherwise noted) RATINGS Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current 75 oC Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) Typical Junction Capacitance (Note) Typical Thermal Resistance Operating and Storage Temperature Range ELECTRICAL CHARACTERISTICS (At = 25oC unless otherwise noted) CHARACTERISTICS Maximum Instantaneous Forward Voltage 1.0A DC Maximum DC Reverse Current oC at Rated DC Blocking Voltage 100 oC Maximum Full Load Reverse Current Average, Full Cycle o.375" (9.5mm) lead length 75 C NOTES : Measured at 1 MHZ and applied reverse voltage of 4.0 volts SYMBOL 1N4006G 1N4007G UNITS 1.1 Volts 5.0 uAmps 50 30 uAmps 2002-12 SYMBOL VRRM VRMS VDC IO I FSM CJ RJA STG 1N4006G 1N4007G UNITS + 150

Single Phase Half Wave 60Hz Resistive or Inductive Load



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Manufacturer information

RECTRON is a leading manufacturer of power semiconductors, offering a comprehensive range of rectifiers including bridge rectifiers, switching diodes, zener diodes, signal transistors and transient voltage suppressors. Product technologies include schottky barrier, ultra fast, super fast, epitaxial, high efficiency, fast recovery, and standard recovery, which is available in a proprietary glass passivated junction construction that significantly increases long term and environmental reliability. All product technologies are produced in a variety of topologies and include axial lead ,SIP, DIP, CASE, surface mount, SOD, SMA, SMB, SMC, DIP, chip & die custom packages.

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