1N4751A-G Datasheet

Surface Mount 1.0W Glass Zender Diode


Features, Applications

DESCRIPTION This surface mountable 1 watt Zener diode series is electrically equivalent to the 1N4728A thru 1N4764A registration in the DO-41 equivalent package except that it meets the JEDEC surface mount outline is an ideal selection for applications of high density and low parasitic requirements for voltage regulation. Standard voltage tolerance is 5% with tighter tolerances available down to 1%. With its glass hermetic qualities, it may also be used for high reliability applications when required by a source control drawing (SCD).

IMPORTANT: For the most current data, consult MICROSEMI's website: http://www.microsemi.com

Electrically similar to the JEDEC registered 1N4728 thru 1N4764 zener series Zener voltages available to 100V Standard voltage tolerances are 5% with "A" suffix and 10 % with no suffix identification Tight tolerances available in plus or minus or 1% with or D suffix respectively Options for screening in accordance with MIL-PRF19500 for JAN, JANTX, JANTXV, and JANS are available by adding MQ, MX, MV, or MSP prefixes respectively to part numbers. Surface mount equivalents also available to SMAJ4764A and to SMAJ4764A Plastic body axial-leaded Zener equivalents are also available to 1N4764A

Regulates voltage over a broad operating current and temperature range Wide selection from 100 V Leadless package for surface mounting Ideal for high density mounting Nonsensitive to ESD Hermetically sealed glass package Specified capacitance (see Figure 2) Inherently radiation hard per MicroNote 050

Power dissipation C: 1.0 watts (also see derating in Figure 1). Operating and Storage temperature: to +175�C Thermal Resistance: 50 �C/W junction to end cap, or 130�C/W junction to ambient when mounted FR4 PC board (1 oz Cu) with recommended footprint (see last page) Steady-State Power: 1.00 watts at TEC or 1.00 watts < 45�C when mounted FR4 PC board and recommended footprint as described for thermal resistance (also see Figure 1) Forward voltage @200 mA: 1.2 volts (maximum) Solder Temperatures: 260 �C for 10 s (max)

CASE: Hermetically sealed DO-213AB glass MELF TERMINALS: Leads, tin-lead plated solderable per MIL-STD-750, method 2026 POLARITY: Cathode indicated by band. Diode to be operated with the banded end positive with respect to the opposite end for Zener regulation MARKING: Cathode band only TAPE & REEL optional: Standard per EIA-481-B with 12 mm tape, 1500 per 7 inch reel or 5000 per 13 inch reel (add "TR" suffix to part number) WEIGHT: 0.05 grams See package dimensions & recommended mounting pad on last page

Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

The type numbers shown with an "A" suffix have a +/-5% tolerance on the nominal Zener voltage. Also available with suffix "C" for +/-2%, and "D" for +/-1%, while the absence of a suffix letter denotes 10% tolerance. The Zener impedance is derived from the 60Hz ac voltage, which results when an ac current having an rms value equal 10% of the dc Zener current (IZT or IZK) is superimposed on IZT or IZK. Zener impedance is measured at two points to ensure a sharp knee on the breakdown curve and eliminate unstable units. The reverse surge current is measured at 25oC ambient using a � square wave or equivalent sine wave pulse 1/120 second duration superimposed on IZT. Voltage measurements to be performed 90 seconds after application of dc current. This product series has also been previously identified as the MLL4728A thru MLL4764A series. This alternate name may still be used.

Power Derating Curve Where TEC is End Cap Temp and TA is Ambient Temperature FR4 PC board.



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Manufacturer information


Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

Microsemi is now a subsidiary of Microchip Technology Inc.

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