Low cost Low leakage Low forward voltage drop High current capability
Case: Molded plastic Epoxy: Device has UL flammability classification 94V-O Lead: MIL-STD-202E method 208C guaranteed Mounting position: Any Weight: 0.38 gram
Ratings 25 C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%.
MAXIMUM RATINGS (At 25 oC unless otherwise noted) RATINGS Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current.375" (9.5mm) lead length = 70oC Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) Typical Junction Capacitance (Note) Typical Thermal Resistance Operating and Storage Temperature Range ELECTRICAL CHARACTERISTICS (At = 25oC unless otherwise noted) CHARACTERISTICS Maximum Instantaneous Forward Voltage 1.5A DC Maximum DC Reverse Current oC at Rated DC Blocking Voltage o C Maximum Full Load Reverse Current Average, Full Cycle o.375" (9.5mm) lead length 75 C NOTES : Measured at 1 MHZ and applied reverse voltage of 4.0 volts SYMBOL 1N5398 1N5399 UNITS 1.4 Volts 5.0 uAmps 50 30 uAmps 2002-11 SYMBOL VRRM VRMS VDC IO I FSM R JA STG 1N5398 1N5399 UNITS + 150FIG. 1 - TYPICAL FORWARD CURRENT DERATING CURVE
Single Phase Half Wave 60Hz Resistive or Inductive Load 0.375" (9.5mm) Lead Length
INSTANTANEOUS FORWARD VOLTAGE, (V) FIG. 4 - TYPICAL JUNCTION CAPACITANCE
RECTRON is a leading manufacturer of power semiconductors, offering a comprehensive range of rectifiers including bridge rectifiers, switching diodes, zener diodes, signal transistors and transient voltage suppressors. Product technologies include schottky barrier, ultra fast, super fast, epitaxial, high efficiency, fast recovery, and standard recovery, which is available in a proprietary glass passivated junction construction that significantly increases long term and environmental reliability. All product technologies are produced in a variety of topologies and include axial lead ,SIP, DIP, CASE, surface mount, SOD, SMA, SMB, SMC, DIP, chip & die custom packages.