1N5822-T Datasheet



Features, Applications


Low switching noise Low forward voltage drop High current capability High switching capabitity High surge capability High reliability

Case: Molded plastic Epoxy: Device has UL flammability classification 94V-O Lead: MIL-STD-202E method 208C guaranteed Mounting position: Any Weight: 1.18 grams

Ratings o C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%.

MAXIMUM RATINGS (At 25 oC unless otherwise noted) RATINGS Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current.375" (9.5mm) lead length 95 oC Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) Typical Thermal Resistance (Note 2) Typical Junction Capacitance (Note 3) Storage and Operating Temperature Range SYMBOL VRRM VRMS VDC IO I FSM JA CJ STG 28 40 UNITS Volts Amps

ELECTRICAL CHARACTERISTICS (At = 25oC unless otherwise noted) CHARACTERISTICS Maximum Instantaneous Forward Voltage 3.0A DC (Note 1) Maximum Instantaneous Forward Voltage 9.4A DC (Note 1) Maximum Average Reverse Current at Rated DC Blocking Voltage (Note o C SYMBOL 2002-11 1N5822.525.950 UNITS Volts mAmps

NOTES : 1. Measured at Pulse Width 300 uS, Duty 2%. 2. Thermal Resistance (Junction to Ambient): Vertical PC Board Mounting, 0.5" (12.7mm) Lead Length. 3. Measured at 1 MHz and applied reverse voltage of 4.0 volts.

Single Phase Half Wave 60Hz Resistive or Inductive Load 0.375" (9.5mm) Lead Length



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Manufacturer information

RECTRON is a leading manufacturer of power semiconductors, offering a comprehensive range of rectifiers including bridge rectifiers, switching diodes, zener diodes, signal transistors and transient voltage suppressors. Product technologies include schottky barrier, ultra fast, super fast, epitaxial, high efficiency, fast recovery, and standard recovery, which is available in a proprietary glass passivated junction construction that significantly increases long term and environmental reliability. All product technologies are produced in a variety of topologies and include axial lead ,SIP, DIP, CASE, surface mount, SOD, SMA, SMB, SMC, DIP, chip & die custom packages.

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