Low power loss, high efficiency Low leakage Low forward voltage High current capability High speed switching High surge capabitity High reliability
Case: Molded plastic Epoxy: Device has UL flammability classification 94V-O Lead: MIL-STD-202E method 208C guaranteed Mounting position: Any Weight: 0.12 gram
Ratings 25 C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%.
MAXIMUM RATINGS (At 25 oC unless otherwise noted) RATINGS Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current.375" (9.5mm) lead length 90 oC Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) Typical Thermal Resistance (Note 1) Typical Junction Capacitance (Note 2) Storage and Operating Temperature Range SYMBOL VRRM VRMS VDC IO I FSM JA CJ STG 28 40 UNITS Volts Amps
ELECTRICAL CHARACTERISTICS (At = 25oC unless otherwise noted) CHARACTERISTICS Maximum Forward Voltage 1.0A DC Maximum Forward Voltage 3.1A DC Maximum Average Reverse Current at Peak Reverse Voltage o C SYMBOL 2003-1 1N19.60.90 UNITS Volts mAmps
NOTES : 1. Thermal Resistance (Junction to Ambient): Vertical PC Board Mounting, 0.5" (12.7mm) Lead Length. 2. Measured at 1 MHz and applied reverse voltage of 4.0 volts.FIG. 1 TYPICAL FORWARD CURRENT DERATING CURVE
Single Phase Half Wave 60Hz Resistive or Inductive Load 0.375" (9.5mm) Lead Length
FIG. 4 - MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT
RECTRON is a leading manufacturer of power semiconductors, offering a comprehensive range of rectifiers including bridge rectifiers, switching diodes, zener diodes, signal transistors and transient voltage suppressors. Product technologies include schottky barrier, ultra fast, super fast, epitaxial, high efficiency, fast recovery, and standard recovery, which is available in a proprietary glass passivated junction construction that significantly increases long term and environmental reliability. All product technologies are produced in a variety of topologies and include axial lead ,SIP, DIP, CASE, surface mount, SOD, SMA, SMB, SMC, DIP, chip & die custom packages.