High reliability Low leakage Low forward voltage drop High current capability Glass passivated junction
Case: Molded plastic black body Epoxy: Device hasUL flammability classification 94V-O Lead: MIL-STD-202E method 208C guaranteed Mounting position: Any Weight: 0.19 gram
Ratings o C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%.
MAXIMUM RATINGS (At 25 oC unless otherwise noted) RATINGS Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current 25 oC Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) Typical Junction Capacitance (Note) Typical Thermal Resistance Operating and Storage Temperature Range ELECTRICAL CHARACTERISTICS (At = 25oC unless otherwise noted) CHARACTERISTICS Maximum Instantaneous Forward Voltage o C Maximum DC Reverse Current at Rated DC Blocking Voltage o C Maximum Full Load Reverse Current Full Cycle Average.375" (9.5mm) lead length = 75oC NOTES : Measured at 1 MHZ and applied reverse voltage of 4.0 volts SYMBOL 1A6G 1A7G UNITS Volts uAmps 2001-5 SYMBOL VRRM VRMS VDC IO I FSM R JA STG + 175Single Phase Half Wave 60Hz Resistive or Inductive Load
INSTANTANEOUS FORWARD VOLTAGE, (V) FIG. 4 - TYPICAL REVERSE CHARACTERISTICS
FIG. 3 - MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 50
RECTRON is a leading manufacturer of power semiconductors, offering a comprehensive range of rectifiers including bridge rectifiers, switching diodes, zener diodes, signal transistors and transient voltage suppressors. Product technologies include schottky barrier, ultra fast, super fast, epitaxial, high efficiency, fast recovery, and standard recovery, which is available in a proprietary glass passivated junction construction that significantly increases long term and environmental reliability. All product technologies are produced in a variety of topologies and include axial lead ,SIP, DIP, CASE, surface mount, SOD, SMA, SMB, SMC, DIP, chip & die custom packages.