Low power loss, high efficiency Low leakage Low forward voltage High current capability High speed switching High surge capability High reliability
Case: Molded plastic Epoxy: Device has UL flammability classification 94V-O Lead: MIL-STD-202E method 208C guaranteed Mounting position: Any Weight: 0.12 gram
Ratings 25 C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%.
MAXIMUM RATINGS (At 25 oC unless otherwise noted) RATINGS Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current A= 25oC Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) Typical Junction Capacitance (Note 2) Operating and Storage Temperature Range SYMBOL VRRM VRMS VDC IO I FSM CJ STG 700 1000 UNITS Volts Amps pF
ELECTRICAL CHARACTERISTICS (At = 25oC unless otherwise noted) CHARACTERISTICS Maximum Instantaneous Forward Voltage 1.0A DC Maximum DC Reverse Current at Rated DC Blocking Voltage 25 oC Maximum Full Load Reverse Current Average, Full Cycle.375" (9.5mm) lead length = 55oC Maximum Reverse Recovery Time (Note 1) NOTES : 1. Test Conditions: = -1.0A, IRR -0.25A 2. Measured at 1 MHZ and applied reverse voltage of 4.0 volts SYMBOL IR 100 trr 50 75 uAmps nSec 1.7 1H8 UNITS Volts uAmpsFIG. 1 - TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTIC
FIG. 2 - TYPICAL FORWARD CURRENT DERATING CURVE 2.0
Single Phase Half Wave 60Hz Resistive or Inductive Load
1 megohm. 22pF. 2. Rise Time = 10ns max. Source Impedance = 50 ohms.
INSTANTANEOUS REVERSE CURRENT, (uA) INSTANTANEOUS FORWARD CURRENT, (A)
FIG. 5 - MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT
RECTRON is a leading manufacturer of power semiconductors, offering a comprehensive range of rectifiers including bridge rectifiers, switching diodes, zener diodes, signal transistors and transient voltage suppressors. Product technologies include schottky barrier, ultra fast, super fast, epitaxial, high efficiency, fast recovery, and standard recovery, which is available in a proprietary glass passivated junction construction that significantly increases long term and environmental reliability. All product technologies are produced in a variety of topologies and include axial lead ,SIP, DIP, CASE, surface mount, SOD, SMA, SMB, SMC, DIP, chip & die custom packages.