The 2SK3434 is N-channel MOS Field Effect Transistor designed for high current switching applications.FEATURES
Super low on-state resistance: 20 m MAX. (VGS 31 m MAX. (VGS = 24 A) Low Ciss: Ciss 2100 pF TYP. Built-in gate protection diodeDrain to Source Voltage Gate to Source Voltage Drain Current (DC) Drain Current (pulse)
Total Power Dissipation (TA = 25�C) Channel Temperature Storage Temperature
Single Avalanche Current Single Avalanche Energy
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Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.Document No. D14603EJ1V0DS00 (1st edition) Date Published March 2000 NS CP(K) Printed in Japan
CHARACTERISTICS Drain to Source On-state Resistance SYMBOL RDS(on)1 RDS(on)2 Gate to Source Cut-off Voltage VGS(off) | yfs | IDSS IGSS Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD VF(S-D) trr Qrr 48 A, VGS 48 A, VGS 0 V, di/dt = 100 A/�s A , VDD 48 V, VGS 24 A, VGS(on) 10 V, VDD = 10 TEST CONDITIONS VGS 24 A VGS 24 A VDS 1 mA VDS 24 A VDS 60 V, VGS 0 V VGS �20 V, VDS 0 V VDS 10 V, VGS = 1 MHz MIN. TYP. MAX. 31 2.5 UNITForward Transfer Admittance Drain Leakage Current Gate to Source Leakage Current Input Capacitance
Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate to Source Charge
Gate to Drain Charge Body Diode Forward Voltage
Reverse Recovery Time Reverse Recovery Charge
The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device.