Homedatasheet5962-8876901YA

5962-8876901YA Datasheet

Class H DSCC SMD 5962-8876801 With Solder Dipped Leads
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Description

Features, Applications
Hermetically Sealed, Low IF, Wide VCC, Logic Gate Optocouplers Technical Data
Features

Dual Marked with Device Part Number and DSCC Standard Microcircuit Drawing Manufactured and Tested a MIL-PRF-38534 Certified Line QML-38534, Class H and K Four Hermetically Sealed Package Configurations Performance Guaranteed over to +125 �C Wide VCC Range to 20 V) 350 ns Maximum Propagation Delay CMR: > 10,000 V/�s Typical 1500 Vdc Withstand Test Voltage Three State Output Available High Radiation Immunity HCPL-2200/31 Function Compatibility Reliability Data Available Compatible with LSTTL, TTL, and CMOS Logic

Isolated Bus Driver (Single Channel) Pulse Transformer Replacement Ground Loop Elimination Harsh Industrial Environments Computer-Peripheral Interfaces

eliminates the potential for output signal chatter. The detector in the single channel units has a tri-state output stage

(Positive Logic) Multichannel Devices Input Output On (H) H Off (L) L
Description

These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level or K testing or from the appropriate DSCC Drawing. All devices are manufactured and tested a MIL-PRF-38534 certified line and are included in the DSCC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits. Each channel contains an AlGaAs light emitting diode which is optically coupled to an integrated high gain photon detector. The detector has a threshold with hysteresis which provides differential mode noise immunity and

Applications

Military and Space High Reliability Systems Transportation and Life Critical Systems High Speed Line Receiver

0.1 �F bypass capacitor must be connected between VCC and GND pins.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

which allows for direct connection to data buses. The output is noninverting. The detector IC has an internal shield that provides a guaranteed common mode transient immunity to 10,000 V/�s. Improved power supply rejection eliminates the need for special power supply bypass precautions. Package styles for these parts are 8 pin DIP through hole (case outline P), 16 pin DIP flat pack (case outline F), and leadless

ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options, see Selection Guide Table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. Because the same electrical die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical

specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part's performance for die related reliability and certain limited radiation test results.

Selection Guide�Package Styles and Lead Configuration Options

Package Lead Style Channels Common Channel Wiring Agilent Part # & Options Commercial MIL-PRF-38534, Class H MIL-PRF-38534, Class K Standard Lead Finish Solder Dipped Butt Cut/Gold Plate Gull Wing/Soldered Class H SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered Class K SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered 8 Pin DIP Through Hole 1 None 8 Pin DIP Through Hole 2 VCC, GND 16 Pin Flat Pack Unformed Leads 4 VCC, GND 20 Pad LCCC Surface Mount 2 None

8 Pin DIP Through Hole 1 Channel 8 Pin DIP Through Hole 2 Channels 16 Pin Flat Pack Unformed Leads 4 Channels

Note: Multichannel DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 6. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES). SOLDER THICKNESS 0.127 (0.005) MAX.

Features

Parameters

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