Homedatasheet5962-8957002KPC

5962-8957002KPC Datasheet

Class H DSCC SMD 5962-8957001 With Solder Dipped Leads
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Description

Features, Applications
Hermetically Sealed, Very High Speed, Logic Gate Optocouplers Technical Data
Features

Dual Marked with Device Part Number and DSCC Standard Microcircuit Drawing Manufactured and Tested a MIL-PRF-38534 Certified Line QML-38534, Class H and K Three Hermetically Sealed Package Configurations Performance Guaranteed over to +125 �C High Speed: 40 M bit/s High Common Mode Rejection 500 V/�s Guaranteed 1500 Vdc Withstand Test Voltage Active (Totem Pole) Outputs Three Stage Output Available High Radiation Immunity HCPL-2400/30 Function Compatibility Reliability Data Compatible with TTL, STTL, LSTTL, and HCMOS Logic Families

Computer-Peripheral Interfaces Switching Power Supplies Isolated Bus Driver (Networking Applications)(5400/1/K Only) Pulse Transformer Replacement Ground Loop Elimination Harsh Industrial Environments High Speed Disk Drive I/O Digital Isolation for A/D, D/A Conversion

Each channel contains an AlGaAs light emitting diode which is optically coupled to an integrated high gain photon detector. This combination results in very high

(Positive Logic) Multichannel Devices Input Output On (H) L Off (L) H
Description

These units are single and dual channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level or K testing or from the appropriate DSCC Drawing. All devices are manufactured and tested a MIL-PRF-38534 certified line and are included in the DSCC Qualified Manufacturers List, QML-38534 for Hybrid Microcircuits.

Applications

Military and Space High Reliability Systems Transportation, Medical, and Life Critical Systems Isolation of High Speed Logic Systems

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

data rate capability. The detector has a threshold with hysteresis, which typically provides mA of differential mode noise immunity and minimizes the potential for output signal chatter. The detector in the single channel units has a three state output stage which eliminates the need for a pull-up resistor and allows for direct drive of a data bus. All units are compatible with TTL, STTL, LSTTL, and HCMOS logic families. The 35 ns pulse width distortion specification guarantees a 10 MBd signaling rate at +125�C with 35% pulse width

distortion. Figures 13 through 16 show recommended circuits for reducing pulse width distortion and optimizing the signal rate of the product. Package styles for these parts are 8 pin DIP through hole (case outlines P), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide Table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. Because the same electrical die (emitters and detectors) are used for each channel of each device

listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are similar for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part's performance for die related reliability and certain limited radiation test results.

Selection Guide�Package Styles and Lead Configuration Options

Package Lead Style Channels Common Channel Wiring Agilent Part # & Options Commercial MIL-PRF-38534, Class H MIL-PRF-38534, Class K Standard Lead Finish Solder Dipped Butt Cut/Gold Plate Gull Wing/Soldered Class H SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered Class K SMD Part # Prescript for all below Either Gold of Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered 8 Pin DIP Through Hole 1 None 8 Pin DIP Through Hole 2 VCC , GND 20 Pad LCCC Surface Mount 2 None

8 Pin DIP Through Hole 1 Channel 8 Pin DIP Through Hole 2 Channels 20 Pad LCCC Surface Mount 2 Channels

Note: All DIP devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES). SOLDER THICKNESS 0.127 (0.005) MAX.

Features

Parameters

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