|Hermetically Sealed, High Speed, High CMR, Logic Gate Optocouplers Technical Data
Dual Marked with Device Part Number and DSCC Drawing Number Manufactured and Tested a MIL-PRF-38534 Certified Line QML-38534, Class H and K Five Hermetically Sealed Package Configurations Performance Guaranteed over to +125�C High Speed: 10 M Bit/s CMR: > 10,000 V/�s Typical 1500 Vdc Withstand Test Voltage 2500 Vdc Withstand Test Voltage for HCPL-565X High Radiation Immunity HCPL-2601, HCPL2630/-31 Function Compatibility Reliability Data TTL Circuit Compatibility
Line Receiver Voltage Level Shifting Isolated Input Line Receiver Isolated Output Line Driver Logic Ground Isolation Harsh Industrial Environments Isolation for Computer, Communication, and Test Equipment Systems(Positive Logic) Multichannel Devices Input On (H) Off (L) Output L H
These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level or K testing or from the appropriate DSCC Drawing. All devices are manufactured and tested a MIL-PRF-38534 certified line and are included in the DSCC Qualified Manufacturers List QML38534 for Hybrid Microcircuits. Quad channel devices are available by special order in the 16 pin DIP through hole packages.Applications
Military and Space High Reliability Systems Transportation, Medical, and Life Critical Systems
The connection 0.1 �F bypass capacitor between VCC and GND is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
Each channel contains a GaAsP light emitting diode which is optically coupled to an integrated high speed photon detector. The output of the detector is an open collector Schottky clamped transistor. Internal shields provide a guaranteed common mode transient immunity specification of 1000 V/�s. For Isolation Voltage applications requiring to 2500 Vdc, the HCPL-5650 family is also available. Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P and
E respectively), and 16 pin surface mount DIP flat pack (case outline F), leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide Table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. Because the same electrical die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute
maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations, and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts' performance for reliability and certain limited radiation test results.Selection Guide�Package Styles and Lead Configuration Options
Package Lead Style Channels Common Channel Wiring Withstand Test Voltage
16 Pin DIP 8 Pin DIP 8 Pin DIP 8 Pin DIP 16 Pin Flat Pack 20 Pad LCCC Through Hole Through Hole Through Hole Through Hole Unformed Leads Surface Mount 2 VCC, GND 1500 Vdc 6N134* HCPL-268K Gold Plate Option #200 Option #100 Option #300 None 8102801TA 59621 None 1500 Vdc HCPL-5601 HCPL-560K Gold Plate Option #200 Option #100 Option 9085501HXA 59622 VCC, GND 1500 Vdc HCPL-5631 HCPL-563K Gold Plate Option #200 Option #100 Option #300 None 9800103K2A 59629800103K2X None 8102805PC 8102805PA None 8102804FC 81028032A None 81028032X Gold Plate Option #200 2 VCC, GND 2500 Vdc HCPL-5651 4 VCC, GND 1500 Vdc HCPL-6651 HCPL-665K Gold Plate 2 None 1500 Vdc HCPL-6631 HCPL-663K Solder Pads
Commercial MIL-PRF-38534, Class K Standard Lead Finish Solder Dipped Butt Cut/Gold Plate Gull Wing/Soldered Class H SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered Class K SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered
Note: All DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 7. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections. All diagrams are "top view."
Agilent DESIGNATOR Agilent P/N DSCC SMD* DSCC SMD* PIN ONE/ ESD IDENT A QYYWWZ XXXXXX XXXXXXX XXX XXX 50434 COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) COUNTRY OF MFR. Agilent CAGE CODE*
Agilent DESIGNATOR Agilent P/N PIN ONE/ ESD IDENT COUNTRY OF MFR. A QYYWWZ XXXXXX XXXX XXXXXX XXX 50434 COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) DSCC SMD* DSCC SMD* Agilent CAGE CODE*