Homedatasheet5962-9959901QPA

5962-9959901QPA Datasheet

ti THS4051, 70-MHz Low-cost Voltage-feedback Amplifier
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Description

Features, Applications

High Speed � 70 MHz Bandwidth 1, �3 dB) � 240 V/�s Slew Rate � 60-ns Settling Time (0.1%) High Output Drive, 100 mA (typ) Excellent Video Performance 0.1 dB Bandwidth of 30 MHz (G Differential Gain � 0.01� Differential Phase Very Low Distortion � THD = �82 dBc = 1 MHz, RL THD = �89 dBc = 1 MHz, 1 k) Wide Range of Power Supplies � VCC �15 V Available in Standard SOIC, MSOP PowerPADTM, or FK Package Evaluation Module Available

description

The THS4051 and THS4052 are general-purpose, single/dual, high-speed voltage feedback amplifiers ideal for a wide range of applications including video, communication, and imaging. The devices offer very good ac performance with 70-MHz bandwidth, 240-V/�s slew rate, and 60-ns settling time (0.1%). The THS4051/2 are stable at all gains for both inverting and noninverting configurations. These amplifiers have a high output drive capability 100 mA and draw only 8.5-mA supply current per channel. Excellent professional video results can be obtained with the low differential gain/phase errors 0.01%/ 0.01� and wide 0.1 dB flatness to 30 MHz. For applications requiring low distortion, the THS4051/2 is ideally suited with total harmonic distortion of �82 dBc at 1 MHz.

RELATED DEVICES DEVICE THS4031/2 THS4081/2 DESCRIPTION 290-MHz Low Distortion High-Speed Amplifiers 100-MHz Low Noise High-Speed Amplifiers 175-MHz Low Power High-Speed Amplifiers Cross Section View Showing PowerPADTM Option (DGN) This device is in the Product Preview stage of development. Please contact your local TI sales office for availability. THS4051 FK PACKAGE (TOP VIEW)

CAUTION: The THS4051 and THS4052 provide ESD protection circuitry. However, permanent damage can still occur if this device is subjected to high-energy electrostatic discharges. Proper ESD precautions are recommended to avoid any performance degradation or loss of functionality. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

AVAILABLE OPTIONS PACKAGED DEVICES TA NUMBER OF CHANNELS PLASTIC SMALL OUTLINE (D) THS4051ID THS4052ID PLASTIC MSOP (DGN) DEVICE THS4051IDGN THS4052IDGN SYMBOL ACQ ACE ACR ACF CERAMIC DIP (JG) CHIP CARRIER (FK) EVALUATION MODULE

THS4051MJG THS4051MFK The D and DGN packages are available taped and reeled. Add an R suffix to the device type (i.e., THS4051CDGN). This device is in the Product Preview stage of development. Please contact your local TI sales office for availability.

absolute maximum ratings over operating free-air temperature (unless otherwise noted)

Supply voltage, VCC. �16.5 V Input voltage, VI. �VCC Output current, IO. 150 mA Differential input voltage, VIO. �4 V Continuous total power dissipation. See Dissipation Rating Table Maximum junction temperature, TJ. 150�C Operating free-air temperature, TA: C-suffix. to 70�C I-suffix. to 85�C M-suffix. to 125�C Storage temperature, Tstg. to 150�C Lead temperature mm (1/16 inch) from case for 10 seconds. 300�C Lead temperature mm (1/16 inch) from case for 60 seconds, JG package. 300�C Case temperature for 60 seconds, FK package. 260�C

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE D DGN� JG JA (�C/W) 119 JC (�C/W) = 25�C POWER RATING 1050 mW

1375 mW This data was taken using the JEDEC standard Low-K test PCB. For the JEDEC Proposed High-K test PCB, the is 95�C/W with a power rating W. � This data was taken using 2 oz. trace and copper pad that is soldered directly a 3 in. � 3 in. PC. For further information, refer to Application Information section of this data sheet.

MIN Supply voltage voltage, VCC+ CC and VCC� CC Dual supply Single supply C-suffix Operating free-air temperature, TA I-suffix M-suffix NOM MAX �C UNIT V


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