Homedatasheet66156-203

66156-203 Datasheet

Bulkhead Mounting, Photodiode Output,
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Description

Features, Applications

PHOTODIODE OUTPUT COAXIAL OR BULKHEAD MOUNT PACKAGES

Features: High Reliability Bulkhead or Press fit version Rugged package Stabile over wide temperature +1.0kIV electrical isolation

Applications: Analog isolation Secure telecom Line receiver Medical Monitor motor control voltage

DESCRIPTION The 66156 contains a Gallium Aluminum Arsenide (GaAIAs) infrared LED optically coupled to a silicon photodiode. This is a hermetically sealed package which is threaded in order to provide convenient bulkhead mounting and is available in standard and screened versions or tested to customer specifications. The is a hermetically sealed coaxial package which can be soldered or press-fit mounted and is also available in the same versions. ABSOLUTE MAXIMUM RATINGS Input to Output Voltage........................................................................................................................................................ 1.0kV Reverse LED Input Voltage...................................................................................................................................................... 3V Peak Forward Input Current 1mS (LED, continuous)....................................................................................................100mA Continuous Transistor Power Dissipation at (or below) 25�C Free-Air Temperature (see Note 2)................................300mW Average Forward Input Current..........................................................................................................................................50mA Reverse Current (LED).......................................................................................................................................................100�A Reverse Voltage (Detector, 1 min. max)................................................................................................................................ 40V Total Output Power Dissipation........................................................................................................................................100mW Storage to +150�C Operating Free-Air Temperature to +85�C Lead Solder Temperature (10 seconds max.)................................................................................................................... 260�C Notes: 1. Derate linearly to 125�C free-air temperature at the rate of 0.68 mA/�C above 65�C. 2. Derate linearly to 125�C free-air temperature at the rate of 3 mW/�C. Package Dimensions

MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION 725 E. Walnut St., Garland, (972) 272-3571 Fax (972) 487-6918

Input Diode Static Forward Voltage Reverse Breakdown Voltage Input Diode Capacitance
Output Voltage Rise Time Fall Time

PARAMETER Input Current, Low Level Input Current, High Level Supply Voltage Operating Temperature SYMBOL IFL IFH VCE TA MIN MAX UNITS

PART NUMBER PART DESCRIPTION Single Channel, to 70�C) operating range. Press-fit, coaxial package Single Channel, to 85�C) operating range. Press-fit, coaxial package Single Channel, to 70�C) operating range. Bulkhead mount package Single Channel, to 85�C) operating range. Bulkhead mount package

MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION 725 E. Walnut St., Garland, (972) 272-3571 Fax (972) 487-6918


Features

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