Homedatasheet6N140A/883

6N140A/883 Datasheet

Class H DSCC SMD 5962-8978501 With Solder Dipped Leads
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Description

Features, Applications
Hermetically Sealed, Low IF, Wide VCC, High Gain Optocouplers Technical Data
Features

Dual Marked with Device Part Number and DSCC Drawing Number Manufactured and Tested a MIL-PRF-38534 Certified Line QML-38534, Class H and K Five Hermetically Sealed Package Configurations Performance Guaranteed, Over to +125 �C Low Input Current Requirement: 0.5 mA High Current Transfer Ratio: 1500% Typical = 0.5 mA Low Output Saturation Voltage: 0.11 V Typical 1500 Vdc Withstand Test Voltage High Radiation Immunity 6N138/9, HCPL-2730/31 Function Compatibility Reliability Data

Isolated Input Line Receiver EIA RS-232-C Line Receiver Voltage Level Shifting Isolated Input Line Receiver Isolated Output Line Driver Logic Ground Isolation Harsh Industrial Environments Current Loop Receiver System Test Equipment Isolation Process Control Input/Output Isolation

both lower saturation voltage and higher signaling speed than possible with conventional photoDarlington optocouplers. The shallow depth and small junctions offered by the IC process provides better radiation immunity than conventional photo transistor optocouplers. The supply voltage can be operated as low 2.0 V without adversely affecting the parametric performance.

Description

These units are single, dual, and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level or K testing or from the appropriate DSCC Drawing. All devices are manufactured and tested a MIL-PRF-38534 certified line and are included in the DSCC Qualified Manufacturers List QML38534 for Hybrid Microcircuits. Each channel contains a GaAsP light emitting diode which is optically coupled to an integrated high gain photon detector. The high gain output stage features an open collector output providing

Applications

Military and Space High Reliability Systems Telephone Ring Detection Microprocessor System Interface Transportation, Medical, and Life Critical Systems

The connection 0.1 �F bypass capacitor between VCC and GND is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

These devices have a 300% minimum CTR at an input current of only 0.5 mA making them ideal for use in low input current applications such as MOS, CMOS, low power logic interfaces or line receivers. Compatibility with high voltage CMOS logic systems is assured by specifying ICCH and IOH at 18 Volts. Upon special request, the following device selections can be made: CTR minimum at 0.5 mA, and lower output leakage current levels to 100 �A.

Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P and E respectively), 16 pin DIP flat pack (case outline F), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide table for details. Standard Military Drawing (SMD) parts are available for each package and lead style. Because the same electrical die (emitters and detectors) are used

for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are similar for all parts except as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities justify the use of a common data base for die related reliability and certain limited radiation test results.

Selection Guide-Package Styles and Lead Configuration Options

Package Lead Style Channels Common Channel Wiring Agilent Part # & Options Commercial MIL-PRF-38534 Class H MIL-PRF-38534 Class K Standard Lead Finish Solder Dipped Butt Cut/Gold Plate Gull Wing/Soldered Crew Cut/Gold Plate Class H SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered Crew Cut/Gold Plate Crew Cut/Soldered Class K SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered Crew Cut/Gold Plate Crew Cut/Soldered

16 pin DIP Through Hole 4 VCC , GND 6N140A/883B HCPL-177K Gold Plate Option #200 Option #100 Option #300 Option #600 None 9800201KZC 9800201KZA

8 pin DIP Through Hole 1 None HCPL-5701 HCPL-570K Gold Plate Option #200 Option #100 Option #300 Option 8981001YA 8981001XA Available 8981002KYA 8981002KXA Available

8 pin DIP Through Hole 2 VCC , GND HCPL-5731 HCPL-573K Gold Plate Option #200 Option #100 Option #300 Option 8978501YA 8978501ZA Available 8978503KYA 8978503KZA Available

16 pin Flat Pack Unformed Leads 4 VCC , GND HCPL-6751 HCPL-675K Gold Plate
20 Pad LCCC Surface Mount 2 None HCPL-6731 HCPL-673K Solder Pads

Note: All DIP and flat pack devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections.

Agilent DESIGNATOR Agilent P/N DSCC SMD* DSCC SMD* PIN ONE/ ESD IDENT A QYYWWZ XXXXXX XXXXXXX XXX 50434 COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) COUNTRY OF MFR. Agilent CAGE CODE*

Agilent DESIGNATOR Agilent P/N PIN ONE/ ESD IDENT COUNTRY OF MFR. A QYYWWZ XXXXXX XXXX XXXXXX XXX 50434 COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) DSCC SMD* DSCC SMD* Agilent CAGE CODE*


Features

Parameters

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Manufacturer information

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