HomedatasheetCHFP6KE5.0CA

CHFP6KE5.0CA Datasheet

Transient Voltage Suppressor, Package : Die
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Description

Features, Applications

FEATURES

Unidirectional and Bidirectional Fully glass passivated 600 watt � s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot

Max Junction Temperature: 1500C (with conformal coating) Storage Temperature: to +1500C Flip-Chip Peak Pulse Power: 600 Watts � s) Maximum non-repetitive peak power 600 Watts � s) Total continuous power dissipation 2.5 W (with adequate heat sink @ 750C) Turn-on time (theoretical) unidirectional 1X10-12 Turn-on time (theoretical) bidirectional 1X10-9

Solderable standoff tabs.040X.040X.010 Waffle package 50 pices or wafer ring 70 pieces
BIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT
UNIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT
ATTACHMENT AND CONFORMAL COATING INSTRUCTIONS FOR Flip-Chip COMPONENTS

The.010" thick tab standoffs minimize shorting during attachment; however, minimal solder/conductive epoxy must be used and carefully controlled to prevent excess attachment material from wicking up the side of the tab and shorting across the junction. Maximum recommended solder temperatures are 212 C for IR reflow and 221 C for vapor-phase reflow. For flip-chip protection, coating material is Stycast TM 2651-40 lowviscosity epoxy manufactured by Emerson & Cuming. Follow instructions carefully for preparation of the epoxy to prevent entrapment of air bubbles. Make sure that Flip-Chips have been baked 100 C for 15 minutes minimum to out-gas any adsorbed moisture immediately prior to coating. Epoxy-coating material should be dispensed around the edges of the chip with an appropriately sized syringe after which epoxy is de-aired to remove bubbles entrapped beneath the chip. Cure epoxy as instructed by the supplier.

Peak Pulse Power (PPP) or Current (IPP) In percent 25� C rating
CHFP6KE5.0 thru CHFP6KE170CA ELECTRICAL Characteristics 25 C Unless otherwise specified

Features

Parameters


Manufacturer information

MICROSEMI CORPORATION

Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

Microsemi is now a subsidiary of Microchip Technology Inc.


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