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AT24C08A-10PU-2.7

Two-wire Serial EEPROM
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Description

Description
The AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT24C01A/02/04/08A/16A is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 5-lead SOT23 (AT24C01A/AT24C02/AT24C04), 8-lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial interface. In addition, the entire family is available in 2.7V (2.7V to 5.5V) and 1.8V (1.8V to 5.5V) versions.

Features
• Low-voltage and Standard-voltage Operation
   – 2.7 (VCC = 2.7V to 5.5V)
   – 1.8 (VCC = 1.8V to 5.5V)
• Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), 1024 x 8 (8K) or 2048 x 8 (16K)
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 100 kHz (1.8V) and 400 kHz (2.7V, 5V) Compatibility
• Write Protect Pin for Hardware Data Protection
• 8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes
• Partial Page Writes Allowed
• Self-timed Write Cycle (5 ms max)
• High-reliability
   – Endurance: 1 Million Write Cycles
   – Data Retention: 100 Years
• Automotive Devices Available
• 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 5-lead SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages
• Die Sales: Wafer Form, Waffle Pack and Bumped Wafers

Features

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