CBT3244 Datasheet

Bus Oriented Circuits


Features, Applications

CBT3244 Octal bus switch with quad output enables
Octal bus switch with quad output enables

Standard '244-type pinout 5 switch connection between two ports TTL compatible control input levels Package options include plastic small outline (D), shrink small

outline (DB), QSOP (DS), thin shrink small outline (TSSOP)

The CBT3244 provides eight bits of high-speed TTL-compatible bus switching in a standard '244 device pinout. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The CBT3244 device is organized as two 4-bit low-impedance switches with separate output-enable (OE) inputs. When OE is low, the switch is on and data can flow from port A to port B, or vice versa. When OE is high, the switch is open and high-impedance state exists between the two ports. The CBT3244 is characterized for operation from to 85 �C.

PIN NUMBER SYMBOL 1B1-1B4 2B1-2B4 GND VCC NAME AND FUNCTION Output enable Inputs Outputs Ground (0V) Positive supply voltage

SYMBOL tPLH tPHL CIO(OFF) ICC PARAMETER Propagation delay to Yn Pin capacitance (OFF state) Quiescent supply current CONDITIONS Tamb = 25 �C; GND = 50 pF; VCC or 0V VCC VI = VCC or GND TYPICAL 6 1 UNIT pF �A

PACKAGES 20-Pin Plastic TSSOP 20-Pin Plastic SSOP (QSOP) 20-Pin Plastic SSOP 20-Pin Plastic SO TEMPERATURE RANGE 85 �C ORDER CODE CBT3244DB CBT3244D DWG NUMBER SOT339-1 SOT163-1

H = High voltage level L = Low voltage level Z = High impedance "off" state

SYMBOL VCC IIK VI IOK VOUT IOUT Tstg PARAMETER DC supply voltage DC input diode current DC input < 0 output in Off or High state output in Low state < 0 CONDITIONS RATING to 150 UNIT mA �C

NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150�C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.



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