GENERAL PURPOSE SILICON DIODES ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES EXCEPT SOLDER REFLOW
Operating Temperature: to +175�C Storage Temperature: to +175�C ELECTRICAL CHARACTERISTICS @ 25�C, unless otherwise specified
METALLIZATION: Top: (Anode)....................Al Back: (Cathode)..............Au THICKNESS............25,000 � Min GOLD THICKNESS........4,000 � Min
22 COREY STREET, MELROSE, MASSACHUSETTS 02176 PHONE (781) 665-1071 FAX (781) 665-7379 WEBSITE: http://www.cdi-diodes.com E-mail: firstname.lastname@example.orgVF - Forward Voltage (V) FIGURE 2 Typical Forward Current vs Forward Voltage 1.2 1.3
NOTE Percent of Reverse Working Voltage FIGURE 3 Typical Reverse Current vs Reverse Voltage
Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
Microsemi is now a subsidiary of Microchip Technology Inc.