1N6677UR-1 AVAILABLE IN JAN, JANTX, JANTXV AND JANS PER & 0.5 AMP SCHOTTKY BARRIER RECTIFIERS HERMETICALLY SEALEDLEADLESS PACKAGE FOR SURFACE MOUNT METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION
Operating Temperature: to +125�C Storage Temperature: to +150�C Average Rectified Forward Current: 0.2 AMP @ TEC = +100�C Derating: / �C above +100�C ELECTRICAL CHARACTERISTICS @ 25�C, unless otherwise specified.
CDI TYPE NUMBER WORKING PEAK REVERSE VOLTAGE VRWM VOLTS CDLL0.2A30 CDLL0.2A40 MAXIMUM REVERSE LEAKAGE CURRENT AT RATED VOLTAGE +100�C mA MAXIMUM CAPACITANCE = 0 VOLTS f =1.0 MHz CT PICO FARADS
Operating Temperature: to +125�C Storage Temperature: to +150�C Average Rectified Forward Current: 0.5 AMP @ TEC = +75�C Derating: / �C above TEC = +75�C ELECTRICAL CHARACTERISTICS @ 25�C, unless otherwise specified.
CASE: DO-213AA, Hermetically sealed glass case. (MELF, SOD-80, LL34) LEAD FINISH: Tin / Lead THERMAL RESISTANCE: (ROJEC): 100 �C/W maximum = 0 inch THERMAL IMPEDANCE: (ZJX): 20 �C/W maximum POLARITY: Cathode end is banded. MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) Of this Device is Approximately +6PPM/�C. The COE of the Mounting Surface System Should Be Selected To Provide A Suitable Match With This Device.WORKING PEAK REVERSE VOLTAGE VRWM VOLTS
MAXIMUM REVERSE LEAKAGE CURRENT AT RATED VOLTAGE mA 1.0
6 LAKE STREET, LAWRENCE, MASSACHUSETTS 01841 PHONE (978) 620-2600 FAX (978) 689-0803 WEBSITE: http://www.microsemi.comTYPICAL REVERSE LEAKAGE CURRENT AT RATED PIV (PULSED)
TYPICAL FORWARD VOLTAGE 100.0 IF, FORWARD CURRENT, INSTANTANEOUS (AMPS)
Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
Microsemi is now a subsidiary of Microchip Technology Inc.