1 WATT ZENER DIODES LEADLESS PACKAGE FOR SURFACE MOUNT DOUBLE PLUG CONSTRUCTION METALLURGICALLY BONDED
Operating Temperature: to +175�C Storage Temperature: to +175�C Power Derating: / �C above TEC = +125�C Forward voltage 200mA: 1.2 volts maximum
CASE: DO-213AB, Hermetically sealed glass case. (MELF, LL41) LEAD FINISH: Tin / Lead THERMAL RESISTANCE: (ROJEC): 100 �C/W maximum = 0 inch THERMAL IMPEDANCE: (ZOJX): 15 �C/W maximum POLARITY: Diode to be operated with the banded (cathode) end positive. MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) Of this Device is Approximately +6PPM/�C. The COE of the Mounting Surface System Should Be Selected To Provide A Suitable Match With This Device.
NOTE 1 "A" suffix 5%, no suffix = +10%, "C" SUFFIX + 2% and "D" suffix + 1%. NOTE 2 Zener impedance is derived by superimposing on lZT A 60Hz rms a.c. current equal 10% of lZT or lZK. NOTE 3 Nominal Zener voltage is measured with the device junction in thermal equilibrium at an ambient temperature + 3�C.
6 LAKE STREET, LAWRENCE, MASSACHUSETTS 01841 PHONE (978) 620-2600 FAX (978) 689-0803 WEBSITE: http://www.microsemi.com
Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
Microsemi is now a subsidiary of Microchip Technology Inc.