CURRENT REGULATOR DIODES LEADLESS PACKAGE FOR SURFACE MOUNT CONSTANT CURRENT OVER WIDE VOLTAGE RANGE HIGH SOURCE IMPEDANCE METALLURGICALLY BONDED
Operating Temperature: to +175�C Storage Temperature: +175�C DC Power Dissipation: @ +50�C Power Derating: / �C above +50�C
CASE: DO-213AB, Hermetically sealed glass case. (MELF, LL41) LEAD FINISH: Tin / Lead THERMAL RESISTANCE: (ROJEC): 100 �C/W maximum = 0 inch
Pulse measurement @ 1% duty cycle, 10 milliseconds maximum. ZS is derived by superimposing A 90Hz RMS signal equal ZK is derived by superimposing A 90Hz RMS signal equal on VK
THERMAL IMPEDANCE: (ZOJX): 25 �C/W maximum POLARITY: Diode to be operated with the band (cathode) end negative. MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) Of this Device is Approximately +6PPM/�C. The COE of the Mounting Surface System Should Be Selected To Provide A Suitable Match With This Device.
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Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
Microsemi is now a subsidiary of Microchip Technology Inc.