PER MIL-PRF-19500/435 LEADLESS PACKAGE FOR SURFACE MOUNT LOW CURRENT OPERATION AT 250 �A METALLURGICALLY BONDED MAXIMUM RATINGS
Junction and Storage Temperature: +175�C DC Power Dissipation: 500mW @ TEC = +125�C Power Derating: 10mW/ �C above TEC = +125�C Forward Derating @ 200 mA: 1.1 Volts maximum ELECTRICAL CHARACTERISTICS @ 25�C, unless otherwise specified.
CASE: DO-213AA, Hermetically sealed glass case. (MELF, SOD-80, LL34) LEAD FINISH: Tin / Lead THERMAL RESISTANCE: (ROJEC): 100 �C/W maximum = 0 inch THERMAL IMPEDANCE: (ZOJX): 35 �C/W maximum POLARITY: Diode to be operated with the banded (cathode) end positive. MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) Of this Device is Approximately +6PPM/�C. The COE of the Mounting Surface System Should Be Selected To Provide A Suitable Match With This Device.
The CDI type numbers shown above have a Zener voltage tolerance 5% of the nominal Zener voltage. Nominal Zener voltage is measured with the device junction in thermal equilibrium at an ambient temperature 3�C. A "C" suffix denotes + 2% tolerance and a "D" suffix denotes + 1% tolerance. Zener impedance is derived by superimposing on lZT, 60 Hz rms a.c. current equal 10% of lZT � A a.c.).
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