50�A, LOW OPERATING CURRENT, ZENER DIODES LEADLESS PACKAGE FOR SURFACE MOUNT DOUBLE PLUG CONSTRUCTION METALLURGICALLY BONDED
Operating Temperature: to +175�C Storage Temperature: to +175�C Power Dissipation: 500mW @ TEC +125�C DC Power Derating: / �C above TEC +125�C Forward Voltage : 1.1 Volts maximum 200 mA ELECTRICAL CHARACTERISTICS @ 25�C, unless otherwise speci�ed.
CASE: DO-213AA, Hermetically sealed glass case. (MELF, SOD-80, LL34) LEAD FINISH: Tin / Lead THERMAL RESISTANCE: (ROJEC): 100 �C/W maximum = 0 inch THERMAL IMPEDANCE: (ZOJX): 35 �C/W maximum POLARITY: Diode to be operated with the banded (cathode) end positive. MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) Of this Device is Approximately +6PPM/�C. The COE of the Mounting Surface System Should Be Selected To Provide A Suitable Match With This Device.
NOTE 1 All types are + 5% tolerance. VZ is measured with the Diode in thermal equilibrium + 3�C. NOTE 100 �A minus @ 10�A.
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Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
Microsemi is now a subsidiary of Microchip Technology Inc.