PER MIL-PRF-19500/463 CURRENT REGULATOR DIODES LEADLESS PACKAGE FOR SURFACE MOUNT METALLURGICALLY BONDED
Operating Temperature: to +175�C Storage Temperature: +175�C DC Power Dissipation: +75�C @ TEC = +125�C Power Derating: / �C above TEC = +125�C Peak Operating Voltage: 100 Volts
CASE: DO-213AB, Hermetically sealed glass case. (MELF, LL41) LEAD FINISH: Tin / Lead THERMAL RESISTANCE: (ROJEC): 50 �C/W maximum = 0 inch THERMAL IMPEDANCE: (ZOJX): 25 �C/W maximum POLARITY: Diode to be operated with the banded (cathode) end negative. MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) Of this Device is Approximately +6PPM/�C. The COE of the Mounting Surface System Should Be Selected To Provide A Suitable Match With This Device.
ZS is derived by superimposing A 90Hz RMS signal equal ZK is derived by superimposing A 90Hz RMS signal equal on VK
6 LAKE STREET, LAWRENCE, MASSACHUSETTS 01841 PHONE (978) 620-2600 FAX (978) 689-0803 WEBSITE: http://www.microsemi.com
Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
Microsemi is now a subsidiary of Microchip Technology Inc.