1N746AUR-1 THRU 1N759AUR-1 AVAILABLE IN JAN, JANTX AND JANTXV PER MIL-PRF-19500/127 1N4370AUR-1 THRU 1N4372AUR-1 AVAILABLE IN JAN, JANTX AND JANTXV PER MIL-PRF-19500/127 LEADLESS PACKAGE FOR SURFACE MOUNT METALLURGICALLY BONDED
Operating Temperature: to +175�C Storage Temperature: +175�C DC Power Dissipation: mW @ TEC = +125�C Power Derating: / �C above TEC = +125�C Forward Voltage 200mA: 1.1 volts maximum
CASE: DO-213AA, Hermetically sealed glass case. (MELF, SOD-80, LL34) LEAD FINISH: Tin / Lead THERMAL RESISTANCE: (ROJEC): 100 �C/W maximum = 0 inch THERMAL IMPEDANCE: (ZOJX): 25 �C/W maximum POLARITY: Diode to be operated with the banded (cathode) end positive. MOUNTING POSITION: Any. MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) Of this Device is Approximately +6PPM/�C. The COE of the Mounting Surface System Should Be Selected To Provide A Suitable Match With This Device.
Zener voltage tolerance on "A" suffix +5%. No Suffix denotes + 10% tolerance. "C" suffix denotes + 2% tolerance and "D" suffix denotes + 1% tolerance. Zener voltage is measured with the device junction in thermal equilibrium at an ambient temperature 25�C, +3�C. Zener impedance is derived by superimposing A 60Hz rms a.c. current equal of 1ZT.
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Microsemi Corporation offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
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