Specially designed for clamping circuits, horizontal deflection systems and damper applications High temperature metallurgically bonded construction Cavity-free glass passivated junction 3.0 ampere operation at TA=50�C with no thermal runaway Typical IR less than 0.1�A Hermetically sealed package Capable of meeting environmental standards of MIL-S-19500 High temperature soldering guaranteed: 350�C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Case: Solid glass body Terminals: Solder plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.04 oz., 1.1 g
Maximum Ratings & Thermal Characteristics Ratings at 25�C ambient temperature unless otherwise specified.
Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=50�C Peak forward surge current 8.3ms single half sine wave superimposed on rated load (JEDEC Method) at TA=50�C Maximum full load reverse current full cycle average 0.375" (9.5mm) lead length at TA=70�C Typical thermal resistanceSymbols VRRM VRMS VDC IF(AV) IFSM IR(AV) RJA TJ, TSTG
Parameter Maximum DC reverse current at rated DC blocking voltage Maximum reverse recovery time IR=1.0A, Irr=0.25ARatings at 25�C ambient temperature unless otherwise specified.
Notes: (1) Thermal resistance from junction to ambient 0.375" (9.5mm) lead length, P.C.B. mounted
Ratings and Characteristic Curves (TA = 25�C unless otherwise noted)
Fig. 2 � Maximum Non-Repetitive Peak Forward Surge Current