Specially designed for clamping circuits, horizontal deflection systems and damper applications Plastic package has Underwriters Laboratory Flammability Classification 94V-0. High temperature metallurgically bonded construction Cavity-free glass passivated junction 1.5 ampere operation at TA=50�C with no thermal runaway Typical IR less than 0.1�A Capable of meeting environmental standards of MIL-S-19500 High temperature soldering guaranteed: 350�C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Case: JEDEC DO-204AC, molded plastic over glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.015 oz., 0.4 g
*Glass-plastic encapsulation technique is covered by Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306.
Maximum Ratings & Thermal Characteristics Ratings at 25�C ambient temperature unless otherwise specified.
Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375" (9.5mm) lead length = 50�C Peak forward surge current 8.3ms single half sine wave superimposed on rated load (JEDEC Method) Maximum full load reverse current full cycle average 0.375" (9.5mm) lead length = 100�C Typical thermal resistanceSymbol VRRM VRMS VDC IF(AV) IFSM IR(AV) RJA TJ, TSTG
Parameter Maximum DC reverse current at rated DC blocking voltage Maximum reverse recovery time IR=1.0A, Irr=0.25ARatings at 25�C ambient temperature unless otherwise specified.
Note: (1) Thermal resistance from junction to ambient 0.375" (9.5mm) lead length, P.C.B. mounted
Ratings and Characteristic Curves (TA = 25�C unless otherwise noted)
Fig.2 - Maximum Non-Repetitive Peak Forward Surge Current