CLB Datasheet

60 X 90 Ta2 N ISOlated or Pin 1 Common Array


Features, Applications

Eight equal value resistors x 0.090 inch chip

The CLA and CLB resistor arrays are the hybrid equivalent to the eight resistor common connection and isolated networks available in SIPS or DIPS. The resistors are spaced on 0.010 inches centers resulting in minimal space requirements. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated Thin Film equipment and manufacturing technology. The CLA and CLBs are 100% electrically tested and visually inspected to MIL-STD-883.

Resistor material: tantalum nitride, self-passivating Oxidized silicon substrate for good power dissipation Custom values available Moisture resistant


The CLA and CLB thin film resistor arrays are designed for hybrid packages requiring up to eight resistors of the same resistance value and tolerance, as well as excellent TCR tracking. For such hybrids, they afford great savings in cost and space.

PARAMETER TCR tracking spread Noise, MIL-STD-202, Method > 251k Moisture resistance, MIL-STD-202, Method 106 Stability, 1000 hours, 125�C, 25mW Absolute Ratio Operating temperature range Thermal shock, MIL-STD-202 Method 107, Test condition F High temperature exposure 150�C, 100 hours Dielectric voltage breakdown Insulation resistance Operating voltage DC power rating + 70�C, (derated to zero 5 x rated power short-time overload, 25�C, 5 seconds - 35dB typical - 20dB typical � 0.5% maximum R/R � 0.25% maximum R/R � 0.05% maximum R/R � 0.1% maximum R/R � 0.2% maximum R/R 200V 1012 minimum 100V 50mW per resistor � 0.1% maximum R/R

PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding pads Number of top pads Pad material Backing OPTIONS: Gold backing for eutectic die attach For custom configurations, Consult Applications Engineer � 0.05mm) Oxidized silicon, 10k� minimum SiO2 Tantalum nitride, self-passivating x 0.178mm) CLA - 16 CLB 9 10k� minimum aluminum None, lapped semiconductor silicon

Example: 100% visualled, � 100ppm/�C TCR, CLA Format, Alum Pads, Class H P/N: W INSPECTION /PACKAGING CLA PRODUCT FAMILY 008 PROCESS CODE See Process Code table 1000 RESISTANCE VALUE Use first 4 significant digits of the resistance 1 MULTIPLIER CODE A F TOLERANCE CODE = 50%

= 100% visually inspected parts per MIL-STD-883 in matrix trays X = Sample, visually inspected loaded in matrix trays (4% AQL)



Manufacturer information

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